Presentations from the 2000 International Conference on Characterization and Metrology for ULSI Technology
Because of the large interest in the talks given at this Conference and as a service to the semiconductor community, the organizers have made the slides from many of the talks presented available here. These slides should be considered the sole property of the speaker. Please do not alter or reproduce any of the slides presented.
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The Conference organizers would like to thank each of the speakers who have made their slides available!
- Junction Depth Measurement Using Carrier Illumination
Peter Borden, Boxer-Cross Co.
- X-ray Metrology by Diffraction and Reflectometry
Keith Bowen (Bede Scientific) & Dick Deslattes (NIST)
- Technology in the Internet Era
Dennis Buss, Texas Instruments
- Impact of the ITRS Metrology Roadmap
Alain Diebold, International SEMATECH
- Guidelines For Selecting Multi-Technology Recipes In Multilayer Filmstack Measurements
Thaddeus Dziura, Therma-Wave
- Optoacoustic Metrology for Copper Interconnects Using Impulsive Stimulated Thermal Scattering (ISTS)
Michael Gostein, Philips Analytical
- Ultra High Resolution X-ray Detectors
Jens Hohne, CSP Cryogenic Spectrometers, Germany
- John Bardeen and Transistor Physics
Howard Huff, International SEMATECH
- Silicon Wafers for the Mesoscopic Era
Howard Huff, International SEMATECH
- Semiconductor Material Applications of Rapid X-ray Reflectometry
William Johnson, Therma-Wave
- The Transition to Cu, Damascene and Low-K Dielectrics for Integrated Circuit Interconnects, Impacts on the Industry
Ken Monnig, International SEMATECH
- Challenges of Gate Dielectric Scaling, Including the Vertical Replacement-Gate MOSFET
Don Monroe, Lucent
- Gate Dielectric Metrology Using Advanced TEM Techniques
David Muller, Bell Labs, Lucent Technologies
- The Status and Future of Imaging Metrology Needs for Lithography
Joost Sytsma, ASML
- Spectroscopic Ellipsometry: From the Vacuum Ultraviolet to the Far Infrared
John Woollam, University of Nebraska
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