How Lead-Free Solder (Mis)Behaves under Stress
October 13, 2012
The reliability and longevity of electronics is critical to our world that is dependent upon Internet and telecommunications technology. Research at the U.S. Department of Energy Office of Science’s Advanced Photon is bringing new information about thermal fatigue in environmentally friendly, lead-free solder joints. These insights bring scientists a step closer to developing useful models for making reliability predictions about solder-joint failure in this important new material.