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Releasable Technologies:

• Method of Fabricating and Integrating High-Quality Decoupling Capacitors
• Method of bumping a thin wafer
• Electronic Connector That Minimizes Bent Pins (For PCMCIA Cards)
• Method of Metallizing a Diamond Substrate without Using a Refractory Metal
• Wafer and Die Thinning Technology
• Wafer Level Coating Designed to Protect Integrated Circuits from Reverse Engineering
• Device for high resolution scanning transmission electron microscopy in a scanning electron microscope
• Native oxide formation technique for Group III-V semiconductor device fabrication that enhances the oxidation rate
• Vertical-cavity surface-emitting laser employing native oxide of Group III-V semiconductor
• PCMCIA Card Connector

These are only a few of the available technologies. To see additional technologies view our complete list of Technology Fact Sheets.

The National Security Agency maintains a continued interest into the field of microelectronics research and development. The NSA develops new designs and refines fabrication technology for complex, sub-micron feature-size integrated circuits that are usually highly classified and produced in small, cost-efficient lots. The Agency uses low risk leverage on industrial microelectronic technology to provide integrated circuits to support its mission.

At the Laboratory for Physical Science, researchers continue to pioneer techniques in several areas in and related to microelectronics research. By working jointly with other government laboratories, industry and the academic community to share and develop advanced microelectronics and materials technologies, we actively encourage research and development activities within this field.

The cooperative relationship between the U.S. semiconductor industry and the NSA microelectronics community creates unique synergistic opportunities. We make a substantial effort to stimulate and maintain this effective interaction. The resulting dialogues and transfers keep the technology flourishing and mutually benefit both parties, while the opportunities that evolve maintain, sustain, and advance the U.S. microelectronics industry.