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NIST Advanced Technology Program
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Competing for the Future: A Historical Review of NIST ATP Investments in Semiconductor and Micro/Nano-Electronics

APPENDIX B - Advanced Technology Program
Semiconductor Micro/Nano-Electronics University Participants by State

Participation University Award # Project Title
JVP Auburn University 8H4007 Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach
SUB Carleton University 8H4025 Advanced Embedded Passives Technology
JVP Carnegie Mellon University 0H3038 Advanced Wafer Inspection for Next-Generation Lithography
SUB Cornell University 8H4007 Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach
JVP Georgia Institute Of Technology 8H4008 Micro-Contact Springs for High-Performance Probing and Packaging
SUB Georgia Institute Of Technology 2H3042 Ceramic Matrix Composite Boards for SOP and SIP Electronic Packaging
SUB Georgia Institute of Technology 8H4012 Novel High-Performance Wafer-Level Reworkable Underfill Materials for Flip-Chip Packaging
SUB Marquette University 4H1513 Solder Jet Technology Development
SUB Massachusetts Institute Of Technology 9H3018 Integrated MEMS Reactor Gas Monitor Using Novel Thin Film Chemistry for the Closed Loop Process Control and Optimization of Plasma Etch and Clean Reactions in the Manufacturing of Microelectronics
SUB Massachusetts Institute Of Technology

3H1378   

 Dry Gas-Phase Cleaning Technology for Single-Wafer Surface Conditioning
SUB North Carolina State University 2H1252 Advancement of Monocrystalline Silicon Carbide Growth Processes
SUB Ohio State University 4H1520 Conducting Polymers: Three Dimensional Engineering for Advanced Applications
SUB Purdue University 2H3034 Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics
JVP Stanford University 8H4067 Intelligent Control of the Semiconductor Patterning Process
SUB Stanford University 8H4013 Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects
JVP State University of New York (SUNY) at Binghamton 2H3034 Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics
JVP University of California at Berkeley 8H4067 Intelligent Control of the Semiconductor Patterning Process
JVP University of California at Irvine 8H4067 Intelligent Control of the Semiconductor Patterning Process
SUB University of California at Santa Barbara 4H3055 High-Speed AFM-Based Platform for Quantitative Nanomechanical Measurements
SUB University of Cincinnati 4H3001 Fully Integrated Gigahertz Receiver Front End
SUB University of Colorado 2H3034 Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics
SUB University of Florida 1H3047 eManufacturing Security Framework to Improve Semiconductor Manufacturing Productivity
SUB University of Maryland 8H4013 Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects
SUB University of Maryland 8H4025 Advanced Embedded Passives Technology
SUB University of Maryland 2H3005 Advanced Technology for Non-destructive, Localized, Dielectric Metrology of Future Generation Integrated Circuits
SUB University of Maryland 2H3005 Advanced Technology for Non-destructive, Localized, Dielectric Metrology of Future Generation Integrated Circuits
JVP University of Michigan at Ann Arbor 8H4067 Intelligent Control of the Semiconductor Patterning Process
SUB University of Michigan, Electrical Engineering and Computer Science Department 0H3033 Printed Organic ASICs: A Disruptive Technology
SUB University of Minnesota 1H1118 Nonvolatile Magnetoresistive Semiconductor Technology
SUB University of Minnesota 8H4063 Integrated GMR Isolated Devices and Planar Transformers
SUB University of Pennsylvania at Philadelphia 4H1520 Conducting Polymers: Three Dimensional Engineering for Advanced Applications
SUB University of Texas - Austin 0H3036 Development of a Short Wavelength Pattern Generator
SUB University of Texas at Austin 1H3047 eManufacturing Security Framework to Improve Semiconductor Manufacturing Productivity
JVP University of Texas at Austin 4H3012 Nano-Imprint Lithography Infrastructure for Low Cost Replication at the 65 nm Node and Beyond
SUB Virginia Polytechnic Institute 3H1365 Low Dielectric Foams for Microelectronics Applications
SUB Washington State University 8H4013 Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects
SUB West Virginia University 8H4021 Chemical Imaging for Semiconductor Metrology
JVP Auburn University 8H4007 Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach
JVP Carnegie Mellon University 0H3038 Advanced Wafer Inspection for Next-Generation Lithography
JVP Georgia Institute Of Technology 1998-06-0012 Micro-Contact Springs for High-Performance Probing and Packaging
JVP Stanford University 8H4067 Intelligent Control of the Semiconductor Patterning Process
JVP State University of New York (SUNY) at Binghamton 2H3034 Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics
JVP University of California at Berkeley 8H4067 Intelligent Control of the Semiconductor Patterning Process
JVP University of California at Irvine 8H4067 Intelligent Control of the Semiconductor Patterning Process
JVP University of Michigan at Ann Arbor 8H4067 Intelligent Control of the Semiconductor Patterning Process
JVP University of Texas at Austin 4H3012 Nano-Imprint Lithography Infrastructure for Low Cost Replication at the 65 nm Node and Beyond
SUB Washington State University 8H4013    Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects
SUB West Virginia University 8H4021 Chemical Imaging for Semiconductor Metrology
SUB Carleton University 8H4025 Advanced Embedded Passives Technology
SUB Cornell University 8H4007 Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach
SUB Georgia Institute Of Technology 2H3042 Ceramic Matrix Composite Boards for SOP and SIP Electronic Packaging
SUB Georgia Institute of Technology 8H4012 Novel High-Performance Wafer-Level Reworkable Underfill Materials for Flip-Chip Packaging
SUB Marquette University 4H1513 Solder Jet Technology Development
SUB Massachusetts Institute Of Technology 9H3018 Integrated MEMS Reactor Gas Monitor Using Novel Thin Film Chemistry for the Closed Loop Process Control and Optimization of Plasma Etch and Clean Reactions in the Manufacturing of Microelectronics
SUB Massachusetts Institute Of Technology 3H1378 Dry Gas-Phase Cleaning Technology for Single-Wafer Surface Conditioning
SUB North Carolina State University 2H1252 Advancement of Monocrystalline Silicon Carbide Growth Processes
SUB Ohio State University 4H1520 Conducting Polymers: Three Dimensional Engineering for Advanced Applications
SUB Purdue University 2H3034 Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics
SUB Stanford University 8H4013 Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects
SUB University of California at Santa Barbara 4H3055 High-Speed AFM-Based Platform for Quantitative Nanomechanical Measurements
SUB University of Cincinnati 4H3001 Fully Integrated Gigahertz Receiver Front End
SUB University of Colorado 2H3034 Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics
SUB University of Florida 1H3047 eManufacturing Security Framework to Improve Semiconductor Manufacturing Productivity
SUB University of Maryland 8H4013 Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects
SUB University of Maryland 8H4025 Advanced Embedded Passives Technology
SUB University of Maryland 2H3005 Advanced Technology for Non-destructive, Localized, Dielectric Metrology of Future Generation Integrated Circuits
SUB University of Maryland 2H3005 Advanced Technology for Non-destructive, Localized, Dielectric Metrology of Future Generation Integrated Circuits
SUB University of Michigan, Electrical Engineering and Computer Science Department 0H3033 Printed Organic ASICs: A Disruptive Technology
SUB University of Minnesota 1H1118 Nonvolatile Magnetoresistive Semiconductor Technology
SUB University of Minnesota 8H4063 Integrated GMR Isolated Devices and Planar Transformers
SUB University of Pennsylvania at Philadelphia 4H1520 Conducting Polymers: Three Dimensional Engineering for Advanced Applications
SUB University of Texas - Austin 0H3036 Development of a Short Wavelength Pattern Generator
SUB University of Texas at Austin 1H3047 eManufacturing Security Framework to Improve Semiconductor Manufacturing Productivity
SUB Virginia Polytechnic Institute 3H1365 Low Dielectric Foams for Microelectronics Applications

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Date created: July 11, 2006
Last updated: September 15, 2006

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