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Competing for the Future: A Historical Review of NIST ATP Investments in Semiconductor and Micro/Nano-Electronics
APPENDIX C - Advanced Technology Program
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| Lead Organization | Project Title | ATP $ (Est.) | Industry Cost-Share $ (Est.) | Start | End |
|---|---|---|---|---|---|
1) Front End Processes and Lithography |
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| ATMI, Inc. | Integrated MEMS Reactor Gas Monitor Using Novel Thin Film Chemistry for the Closed Loop Process Control and Optimization of Plasma Etch and Clean Reactions in the Manufacturing of Microelectronics |
$1,711,348 | $2,062,152 | 11/12/99 | 10/31/02 |
| Cree Inc. (formerly Cree Research Inc. | Advancement of Monocrystalline Silicon Carbide Growth Processes | $1,956,853 | $434,734 | 06/15/92 | 06/14/94 |
| Diamond Semiconductor Group, Inc. | New Technology for High-Current, Parallel, Broad-Beam Implanters for Microelectronics Fabrication |
$1,327,000 | $398,000 | 03/01/93 | 06/30/94 |
| Epion Corp of JDS Uniphase Corporation (formerly Epion Corporation) | Gas-Cluster Ion-Beam Manufacturing Tool for Next-Generation Semiconductor Devices | $2,000,000 | $2,136,981 | 10/01/98 | 09/30/01 |
| Etec Systems, Inc. | Development of a Short Wavelength Pattern Generator | $2,000,000 | $3,709,459 | 11/01/00 | 10/31/03 |
| FEI Company, Micrion Division (formerly Micrion Corp) | Early Prototype Non-Gallium Ion Beam for Lithography and Wafer Manufacturing | $1,581,605 | $727,538 | 11/01/98 | 12/31/00 |
| GE Research (formerly GE Corporate R&D) | Novel Synthetic Fused Quartz for Semiconductor Manufacturing | $482,168 | $670,889 | 09/01/95 | 08/31/98 |
| Hampshire Instruments, Inc. | Solid-State Laser Technology for Point-Source X-Ray Lithography | $1,090,000 | $1,094,568 | 07/01/91 | 09/30/92 |
| IBM Corporation, Almaden Research Center | Low Dielectric Foams for Microelectronics Applications | $1,830,929 | $2,952,822 | 03/01/93 | 02/28/96 |
| KLA-Tencor | Intelligent Control of the Semiconductor Patterning Process | $9,110,456 | $9,182,319 | 01/01/99 | 08/30/02 |
| Lucent Technologies, Inc. (formerly AT&T Bell Laboratories) | Fabrication and Testing of Precision Optics for Soft X-Ray Projection Lithography | $2,000,000 | $3,525,000 | 05/15/91 | 05/14/94 |
| Molecular Imprints, Inc. | Nano-Imprint Lithography Infrastructure for Low Cost Replication at the 65 nm Node and Beyond |
$17,623,118 | $19,167,367 | 05/01/04 | 04/30/07 |
| Multibeam Systems Inc., | Development and Demonstration of a Multiple, High-Current-Density Shaped E-Beam Column With Independent Vector Beam Placement |
$1,999,180 | $708,300 | 10/01/04 | 09/30/06 |
| RAPT Industries | Reactive Atom Plasma (RAP) Processing-A Novel Process for Rapid Optics Fabrication |
$1,950,000 | $1,562,442 | 05/01/03 | 05/31/06 |
| Xradia, Inc. | Achromatic Fresnel Optic for EIV and X-ray Radiation: An Innovative Camera Concept for Next Generation Lithography |
$2,000,000 | $665,454 | 11/01/02 | 03/31/05 |
2 ) Assembly, Packaging, and Interconnect |
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Advanced Embedded Passives Technology Consortium (c/o NCMS) |
Advanced Embedded Passives Technology | $7,804,654 | $8,301,846 | 02/01/99 | 01/31/03 |
| BH Electronics, Inc. | Ultraminiature Transformer and Inductor Design and Manufacture | $695,458 | $90,930 | 10/01/03 | 06/30/05 |
| Dow Chemical Company | Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects | $8,556,629 | $9,049,142 | 04/01/99 | 09/30/02 |
| General Electric Company | Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics | $3,506,139 | $3,761,381 | 11/01/02 | 10/31/05 |
| IBM Corporation, T.J. Watson Research Center | Conducting Polymers: Three Dimensional Engineering for Advanced Applications | $1,987,530 | $1,422,386 | 04/01/94 | 03/31/97 |
| Kopin Corporation | Scalable High-Density Electronics Based on MultiFilm Modules | $2,776,131 | $2,929,177 | 09/15/92 | 09/15/9209/15 |
| MicroFab Technologies, Inc. | Solder Jet Technology Development | $1,639,000 | $798,000 | 01/01/94 | 12/31/96 |
| Motorola, Inc. | Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach | $4,189,807 | $4,494,502 | 04/09/99 | 10/08/03 |
National Center For Manufacturing Sciences, Inc. |
Printed Wiring Board Interconnect Systems | $13,782,990 | $14,674,484 | 04/15/91 | 04/14/96 |
| National Starch and Chemical, Inc. | Novel High-Performance Wafer-Level Reworkable Underfill Materials for Flip-Chip Packaging |
$2,851,841 | $2,909,252 | 12/09/98 | 12/08/02 |
Palo Alto Research Center, Inc. (formerly Xerox PARC) |
Micro-Contact Springs for High-Performance Probing and Packaging | $4,933,158 | $4,962,997 | 01/01/99 | 06/30/03 |
| Starfire Systems | Ceramic Matrix Composite Boards for SOP and SIP Electronic Packaging | $1,739,322 | $2,087,186 | 11/01/02 | 10/31/05 |
| Texas Instruments, Inc. | Ultra-Low k Dielectric Materials for High-Performance Interconnects | $1,971,000$3,588,000 | $3,588,000 | 03/01/95 | 02/28/98 |
| nLine Corporation | Digital Holographic Inspection of Semiconductor Devices | $9,395,604 | $9,779,101 | 11/01/00 | 05/09/06 |
| STAR Cryoelectronics, LLC | Next-Generation Energy Dispersive Spectrometer for X-Ray Microanalysis | $1,833,376 | $928,877 | 10/01/04 | 09/30/07 |
4) Environment, Safety, and Health |
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| Brewer Science, Inc. | Contact Planarization for Microlithographic Processes | $2,000,000 | $1,495,840 | 10/01/01 | 01/31/04 |
| FSI International, Inc | Dry Gas-Phase Cleaning Technology for Single-Wafer Surface Conditioning | $2,000,000 | $3,482,000 | 03/01/93 | 02/28/95 |
| Uncopiers, Inc. | ACIM "Point*Suns": Concentrating Energy Through Silent Sound and Clean Water |
$2,000,000 | $310,730 | 09/01/01 | 08/31/04 |
5) Design, Modeling, and Simulation |
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| Cascade Microtech, Inc. | Membrane Probes for Wafer, Package, and Substrate Testing | $1,996,798 | $3,369,652 | 11/01/98 | 10/31/01 |
| DAFCA, Inc. | Reconfigurable Infrastructure Platform for Systems-on-Chips | $1,828,050 | $756,642 | 10/01/04 | 09/30/07 |
6) Process Integration, Devices, and Structures |
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| Agility Communications, Inc. | 40 Gb/s Widely Tunable Photonic Integrated Transmitter | $1,999,761 | $1,004,239 | 06/01/03 | 05/31/06 |
| Athena Group, Inc. | High Performance ASIC Technology for Digital Signal Processing | $1,859,669 | $415,450 | 10/01/98 | 09/30/00 |
| Luxtera, Inc. | Nanophotonic Integrated Circuits for Telecommunications and Computing | $1,999,960 | $2,193,728 | 11/01/02 | 10/31/04 |
| NVE Corporation (formerly Novolatile Electronics, Inc.) | Nonvolatile Magnetoresistive Semiconductor Technology | $1,738,600 | $869,300 | 04/01/91 | 03/31/94 |
NVE Corporation (formerly Nonvolatile Electronics Inc.) |
Integrated GMR Isolated Devices and Planar Transformers | $1,813,992 | $1,125,208 | 11/01/97 | 10/31/00 |
| SemiSouth Laboratories, Inc. | Silicon Carbide Smart Power Chip | $1,776,466 | $761,906 | 10/01/04 | 09/30/07 |
| The Athena Group, Inc. | PowerFlow: Next-Generation Intellectual Property Technology for System-on-a-Chip Designs |
$1,999,859 | $822,086 | 10/01/03 | 09/30/06 |
7) Emerging Research Devices and Organic Electronics |
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| Motorola, Inc. | Printed Organic ASICs: A Disruptive Technology | $7,675,745 | $7,989,041 | 11/01/00 | 10/31/05 |
| Sarnoff Corporation | Printed Organic Transistors on Plastic for Electronic Displays and Circuits | $5,734,114 | $5,755,033 | 11/01/02 | 10/31/05 |
8) RF and Analog/Mixed-signal Technologies for Wireless Communications |
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| Aether Wire & Location, Inc. | Instant Networks Using Coin-sized Ultrawideband (UWB) Localizers | $1,985,240 | $940,452 | 05/01/04 | 04/30/07 |
| Discera, Inc. | Fully Integrated Gigahertz Receiver Front End | $2,000,000 | $1,734,357 | 05/01/04 | 01/31/07 |
| Innovative Wireless Technologies, Inc. | Unified Radio Architecture - A Cognitive Radio Platform | $1,999,986 | $1,512,032 | 11/01/04 | 08/30/07 |
| Intematix Corporation | Rapid and Comprehensive Development of Advanced Dielectric Materials for Wireless Appplications |
$2,000,000 | $1,169,688 | 10/01/01 | 01/31/04 |
| PowerSicel, Inc. | High Performance Transistors for Broadband Wireless Communications | $1,989,783 | $1,000,000 | 07/01/03 | 06/30/05 |
| STI, Inc. (formerly Conductus, Inc.) | Advanced Receiver Front-end Technology for 4G Wireless Systems | $1,988,968 | $4,985,706 | 11/01/00 | 10/31/03 |
| TriQuint Semiconductor Texas, L.P. | Advanced HBT Power Amplifier Technology for Broadband Communications Systems |
$3,119,859 | $4,271,618 | 11/01/00 | 03/31/04 |
| Vitesse Semiconductor Corporation | GaAs Super Microprocessor Technology Development | $2,000,000 | $6,324,896 | 03/01/94 | 12/31/96 |
9) Factory Integration |
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| Advanced Micro Devices | eManufacturing Security Framework to Improve Semiconductor Manufacturing Productivity |
$5,047,062 | $5,049,082 | 11/01/01 | 10/31/05 |
| Advanced Micro Devices | Agent-Enhanced Manufacturing System Initiative | $2,394,319 | $2,492,049 | 12/01/97 | 12/31/01 |
Asyst Connectivity Technologies, Inc. (formerly Domain Logix Corporation) |
Intelligent Equipment for Semiconductor Manufacturing | $1,452,110 | $494,839 | 11/01/00 | 10/31/02 |
| Consilium, Inc. | Distributed Factory System Framework | $2,000,000 | $1,353,000 | 11/01/97 | 04/30/99 |
KLA-Tencor (formerly Honeywell, Inc., Technology Center) |
Advanced Process Control Framework Initiative | $4,906,758 | $5,101,241 | 02/01/96 | 10/31/98 |
Return to report.
Date created: July 11, 2006
Last updated:
September 15, 2006
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