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Competing for the Future: A Historical Review of NIST ATP Investments in Semiconductor and Micro/Nano-Electronics
APPENDIX A - Advanced Technology Program
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Grant Number |
State | Single or Joint | Total |
Total Industry |
Company or JV Lead |
Project Title |
|---|---|---|---|---|---|---|
0H3038 |
California | JVL | $6,716,870 | $7,002,847 | KLA-Tencor Corporation | Advanced Wafer Inspection for Next-Generation Lithography |
1H3047 |
California | JVL | $5,047,062 | $5,049,082 | Advanced Micro Devices | eManufacturing Security Framework to Improve Semiconductor Manufacturing Productivity |
6H2002 |
California | JVL | $4,906,758 | $5,101,241 | KLA-Tencor (formerly Honeywell, Inc., Technology Center) | Advanced Process Control Framework Initiative |
8H4008 |
California | JVL | $4,933,158 | $4,962,997 | Palo Alto Research Center, Inc. (formerly Xerox PARC) | Micro-Contact Springs for High-Performance Probing and Packaging |
8H4024 |
California | JVL | $18,912,000 | $24,443,000 | KLA-Tencor Corporation | Intelligent Mask Inspection System for Next-Generation Lithography |
8H4067 |
California | JVL | $9,110,456 | $9,182,319 | KLA-Tencor | Intelligent Control of the Semiconductor Patterning Process |
0H3032 |
California | SA | $1,988,968 | $4,985,706 | STI, Inc. (formerly Conductus, Inc.) | Advanced Receiver Front-end Technology for 4G Wireless Systems |
0H3036 |
California | SA | $2,000,000 | $3,709,459 | Etec Systems, Inc. | Development of a Short Wavelength Pattern Generator |
1H3044 |
California | SA | $2,000,000 | $1,169,688 | Intematix Corporation | Rapid and Comprehensive Development of Advanced Dielectric Materials for Wireless Appplications |
2H3033 |
California | SA | $1,999,960 | $2,193,728 | Luxtera, Inc. | Nanophotonic Integrated Circuits for Telecommunications and Computing |
2H3038 |
California | SA | $2,000,000 | $665,454 | Xradia, Inc. | Achromatic Fresnel Optic for EIV and X-ray Radiation: An Innovative Camera Concept for Next Generation Lithography |
3H1365 |
California | SA | $1,830,929 | $2,952,822 | IBM Corporation, Almaden Research Center | Low Dielectric Foams for Microelectronics Applications |
3H3001 |
California | SA | $1,950,000 | $1,562,442 | RAPT Industries | Reactive Atom Plasma (RAP) Processing-A Novel Process for Rapid Optics Fabrication |
3H3005 |
California | SA | $1,999,761 |
$1,004,239 | Agility Communications, Inc. | 40 Gb/s Widely Tunable Photonic Integrated Transmitter |
4H1504 |
California | SA | $2,000,000 |
$6,324,896 | Vitesse Semiconductor Corporation | GaAs Super Microprocessor Technology Development |
4H3016 |
California | SA | $1,985,240 |
$940,452 | Aether Wire & Location, Inc. | Instant Networks Using Coin-sized Ultrawideband (UWB) Localizers |
4H3047 |
California | SA | $1,999,180 |
$708,300 | Multibeam Systems Inc., | Development and Demonstration of a Multiple, High-Current-Density Shaped E-Beam Column With Independent Vector Beam Placement |
7H3043 |
California | SA | $2,000,000 |
$1,353,000 | Consilium, Inc. | Distributed Factory System Framework |
3H3016 |
Colorado | SA | $1,989,783 |
$1,000,000 | PowerSicel, Inc. | High Performance Transistors for Broadband Wireless Communications |
9H3018 |
Connecticut | SA | $1,711,348 |
$2,062,152 | ATMI, Inc. | Integrated MEMS Reactor Gas Monitor Using Novel Thin Film Chemistry for the Closed Loop Process Control and Optimization of Plasma Etch and Clean Reactions in the Manufacturing of |
3H3032 |
Florida | SA | $1,999,859 |
$822,086 | The Athena Group, Inc. | PowerFlow: Next-Generation Intellectual Property Technology for System-on-a-Chip Designs |
7H3021 |
Florida | SA | $1,859,669 |
$415,450 | Athena Group, Inc. | High Performance ASIC Technology for Digital Signal Processing |
0H3033 |
Illinois | JVL | $7,675,745 |
$7,989,041 | Motorola, Inc. | Printed Organic ASICs: A Disruptive Technology |
8H4007 |
Illinois | JVL | $4,189,807 |
$4,494,502 | Motorola, Inc. | Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach |
1H3006 |
Kansas | SA | $2,000,000 |
$310,730 | Uncopiers, Inc. | ACIM "Point*Suns": Concentrating Energy Through Silent Sound and Clean Water |
2H3005 |
Maryland | SA | $1,968,348 |
$1,410,453 | Neocera, Inc. | Advanced Technology for Non-destructive, Localized, Dielectric Metrology of Future Generation Integrated Circuits |
2H1254 |
Massachusetts | JVL | $2,776,131 | $2,929,177 | Kopin Corporation | Scalable High-Density Electronics Based on MultiFilm Modules |
3H1383 |
Massachusetts | SA | $1,327,000 | $398,000 | Diamond Semiconductor Group, Inc. | New Technology for High-Current, Parallel, Broad-Beam Implanters for Microelectronics Fabrication |
3H3039 |
Massachusetts | SA | $2,000,000 | $1,406,744 | Micro Magnetics, Inc. | Spintronics-Based High-Resolution, Non-Invasive, and Ultrafast Metrology for the Semiconductor Industry |
4H3049 |
Massachusetts | SA | $1,828,050 | $756,642 | DAFCA, Inc. | Reconfigurable Infrastructure Platform for Systems-on-Chips |
8H4011 |
Massachusetts | SA | $2,000,000 | $2,136,981 | Epion Corp of JDS Uniphase Corporation (formerly Epion Corporation) | Gas-Cluster Ion-Beam Manufacturing Tool for Next-Generation Semiconductor Devices |
1H1112 |
Michigan | JVL | $13,782,990 | $14,674,484 | National Center For Manufacturing Sciences, Inc. | Printed Wiring Board Interconnect Systems |
4H3055 |
Michigan | JVL | $6,560,714 | $6,828,495 | Dow Chemical Company | High-Speed AFM-Based Platform for Quantitative Nanomechanical Measurements |
8H4013 |
Michigan | JVL | $8,556,629 | $9,049,142 | Dow Chemical Company | Ultra-Low Dielectric Constant Materials for Integrated Circuit Interconnects |
8H4025 |
Michigan | JVL | $7,804,654 | $8,301,846 | Advanced Embedded Passives Technology Consortium (c/o NCMS) | Advanced Embedded Passives Technology |
4H3001 |
Michigan | SA | $2,000,000 | $1,734,357 | Discera, Inc. | Fully Integrated Gigahertz Receiver Front End |
1H1118 |
Minnesota | SA | $1,738,600 | $869,300 | N V E (formerly Novolatile Electronics, Inc.) | Nonvolatile Magnetoresistive Semiconductor Technology |
3H1378 |
Minnesota | SA | $2,000,000 | $3,482,000 | FSI International, Inc | Dry Gas-Phase Cleaning Technology for Single-Wafer Surface Conditioning |
3H3035 |
Minnesota | SA | $695,458 | $90,930 | BH Electronics, Inc. | Ultra miniature Transformer and Inductor Design and Manufacture |
8H4063 |
Minnesota | SA | $1,813,992 | $1,125,208 | NVE Corporation (formerly Nonvolatile Electronics Inc.) | Integrated GMR Isolated Devices and Planar Transformers |
4H3054 |
Mississippi | SA | $1,776,466 | $761,906 | SemiSouth Laboratories, Inc. | Silicon Carbide Smart Power Chip |
1H3019 |
Missouri | SA | $2,000,000 | $1,495,840 | Brewer Science, Inc. | Contact Planarization for Microlithographic Processes |
2H3032 |
New Jersey | JVL | $5,734,114 | $5,755,033 | Sarnoff Corporation | Printed Organic Transistors on Plastic for Electronic Displays and Circuits |
8H4012 |
New Jersey | JVL | $2,851,841 | $2,909,252 | National Starch and Chemical, Inc. | Novel High-Performance Wafer-Level Reworkable Underfill Materials for Flip-Chip Packaging |
1H1115 |
New Jersey | SA | $2,000,000 | $3,525,000 | Lucent Technologies, Inc. (formerly AT&T Bell Laboratories) | Fabrication and Testing of Precision Optics for Soft X-Ray Projection Lithography |
4H3056 |
New Mexico | SA | $1,833,376 | $928,877 | STAR Cryoelectronics, LLC | Next-Generation Energy Dispersive Spectrometer for X-Ray Microanalysis |
1H1117 |
New York | JVL | $1,090,000 | $1,094,568 | Hampshire Instruments, Inc. | Solid-State Laser Technology for Point-Source X-Ray Lithography |
2H3034 |
New York | JVL | $3,506,139 | $3,761,381 | General Electric Company | Nanoengineered Thermal Interfaces Enabling Next Generation Microelectronics |
2H3042 |
New York | SA | $1,739,322 | $2,087,186 | Starfire Systems | Ceramic Matrix Composite Boards for SOP and SIP Electronic Packaging |
4H1520 |
New York | SA | $1,987,530 | $1,422,386 | IBM Corporation, T.J. Watson Research Center | Conducting Polymers: Three Dimensional Engineering for Advanced Applications |
5H1103 |
New York | SA | $482,168 | $670,889 | GE Research (formerly GE Corporate R&D) | Novel Synthetic Fused Quartz for Semiconductor Manufacturing |
2H1252 |
North Carolina | SA | $1,956,853 | $434,734 | Cree Inc. (formerly Cree Research Inc. | Advancement of Monocrystalline Silicon Carbide Growth Processes |
| 8H4009 | Oregon | SA | $1,581,605 | $727,538 | FEI Company, Micrion Division (formerly Micrion Corp) |
Early Prototype Non-Gallium Ion Beam for Lithography and Wafer Manufacturing |
| 8H4010 | Oregon | SA | $1,996,798 | $3,369,652 | Cascade Microtech, Inc. |
Membrane Probes for Wafer, Package, and Substrate Testing |
| 8H4021 | Pennsylvania | JVL | $2,936,781 | $3,594,790 | ChemIcon, Inc. |
Chemical Imaging for Semiconductor Metrology |
| 0H3030 | Texas | JVL | $3,119,859 | $4,271,618 | TriQuint Semiconductor Texas, L.P. |
Advanced HBT Power Amplifier Technology for Broadband Communications Systems |
| 0H3034 | Texas | JVL | $9,395,604 | $9,779,101 | nLine Corporation |
Digital Holographic Inspection of Semiconductor Devices |
| 4H3012 | Texas | JVL | $17,623,118 | $19,167,367 | Molecular Imprints, Inc. |
Nano-Imprint Lithography Infrastructure for Low Cost Replication at the 65 nm Node and Beyond |
| 7H3041 | Texas | JVL | $2,394,319 | $2,492,049 | Advanced Micro Devices |
Agent-Enhanced Manufacturing System Initiative |
| 0H3018 | Texas | SA | $1,452,110 | $494,839 | Asyst Connectivity Technologies, Inc. (formerly Domain Logix Corporation) |
Intelligent Equipment for Semiconductor Manufacturing |
| 4H1513 | Texas | SA | $1,639,000 | $798,000 | MicroFab Technologies, Inc. |
Solder Jet Technology Development |
| 5H1064 | Texas | SA | $1,971,000 | $3,588,000 | Texas Instruments, Inc. |
Ultra-Low k Dielectric Materials for High-Performance Interconnects |
| 4H3033 | Virginia | SA | $1,999,986 | $1,512,032 | Innovative Wireless Technologies, Inc. |
Unified Radio Architecture - A Cognitive Radio Platform |
| TOTAL | $224,727,108 | $230,241,430 | ||||
Return to report or go to next section.
Date created: July 11, 2006
Last updated:
September 15, 2006
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