- Long Description
This Memorandum is to communicate an awareness regarding the potential product integrity concerns due to use of solder andlor component finishes that are lead free. Certification applicants should ensure that their systems and programs minimize the impacts due to the global transition to lead free. Each applicant should assess and mitigate the applicable risks in order to meet and comply with the applicable airworthiness requirements.
- File Title
- AIR100-2011-120-003
- File
- URL Title
- Link to AIR100-2011-120-003
- Web Site Address
- http://www.airweb.faa.gov/Regulatory_and_Guidance_Library/rgPolicy.nsf/0/2d...
- Benefit/Value
Communicates awareness regarding potential product integrity concerns due to the use of lead-free solder and component finishes. Advises applicant organizations to have a Lead-Free Control Program that will mitigate the applicable risks in order to meet/comply with airworthiness requirements.
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| ID | 460944 |
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| Date Created | Friday, August 5, 2011 7:48 AM |
| Date Modified | Friday, August 5, 2011 8:01 AM |
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| Version Comment: | |
