- Long Description
This report outlines the findings derived from a study into the issues associated with the use of lead-free solder in electronic systems. It provides an assessment of the potential problems that might arise from the transition from the traditional tin-lead solder to alternative lead-free solder alloys. The information will enable the Australian Defence Force (ADF) to better understand the differences in alternative alloy properties and behaviour that may affect ADF systems if implemented. There is currently no single recommended lead-free solder alloy for military environments. The use of current lead-free solders brings with it the risk of reduced reliability for electronic systems and the implications for ADF systems, especially mission critical systems, need to be understood.
- File Title
- Investigation into Lead-Free Solder in Australian Defence Force Applications
- File
- Benefit/Value
The aim of this report is to explore the issues of lead-free solder (and lead-free finishes) to aid in understanding the effects it will have on item performance and reliability. Organisations and research groups worldwide have studied/experimented on lead-free solders and have published experimental data and results from testing the performances of different lead-free solders. A selection of these results are also summarised to provide insight into the strengths and weaknesses of some lead-free alloys. It should be noted that most of the collated data targets commercial industries, therefore experimental conditions from which the results are based may not be sufficient to reflect the service conditions experienced in the military environment.
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| ID | 445103 |
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| Date Created | Monday, May 9, 2011 1:47 PM |
| Date Modified | Monday, May 9, 2011 1:49 PM |
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| Version Comment: | |
