IPC-7711/7721: Rework and Repair Guidelines prescribes the procedural requirements, tools, materials, and methods to be used in the modification, rework, repair, overhaul, or restoration of electronic products. Although this document is based in large part on the Product Class Definitions of ANSI/J-STD-001, this document should be considered applicable to any type of electronic equipment. When invoked by contract as the controlling document for the modification, rework, repair, overhaul, or restoration of products, the requirements flowdown apply. This guide includes everything needed for modification, repair, and rework of electronic assemblies and printed circuit boards. IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies.