Non-Government Standards and Handbooks applicable to Lead-free (TechAmerica/GEIA)

TechAmerica ANSI-GEIA-STD-0005-1 Standard: Performance Standard for Aerospace and Military Electronic Systems Containing Lead-Free Solder is a commercial standard defining the objectives of and requirements for the processes to assure customers that aerospace and military electronic systems containing lead-free (Pb-free) solder and finishes will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the lifecycle.  This standard communicates the requirements for a Lead-Free Control Plan (LFCP) to assist suppliers in the development of their own LFCPs.  The LFCP documents the owner’s (or supplier’s) processes to assure their customers and all other stakeholders that the products will continue to meet their requirements.  This standard does not contain detailed descriptions of the processes to be documented, but lists high-level requirements for such processes, and areas of concern to the aerospace and military electronics industries.  This standard applies only to entities within the control of the aerospace and military electronics system supply chain; and is intended to address issues that are unique to these industries.  Some applications may have unique requirements that exceed the scope of this standard and should be covered separately.

TechAmerica ANSI-GEIA-STD-0005-2 Standard: Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems is a commercial standard that establishes the processes for mitigating the effects of tin whiskers in aerospace and military electronic systems.  This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems.  This standard is applicable to aerospace and military electronics applications, which may procure equipment containing lead-free (Pb-free) tin finishes.

TechAmerica ANSI-GEIA-STD-0005-3 Standard: Reliability Testing for Aerospace and High Performance Electronics Containing Lead-Free Solder is a commercial standard that addresses performance testing of lead-free solders and finishes used in aerospace and military electronic systems.  This standard addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing lead-free (Pb-free) solder.  One failure mode, fatigue-failure thru the solder-joint, is considered a primary failure mode in aerospace and military electronics and can be understood in terms of physics of failure and life-projections.  Understanding all of the potential failure modes caused by Pb-free solder of aerospace and military electronics is a critical element in defining early field-failures/reliability issues.  Grouping of different failure modes may result in incorrect and/or misleading test conclusions.  Failure analysis efforts should be conducted to ensure that individual failure modes are identified, thus enabling the correct application of reliability assessments and life-projection efforts.  For programs that were designed with SnPb solder, and are currently not using any Pb-free solder, the traditional methods may be used.  It is important, however, for those programs to have processes in place to maintain the SnPb configuration including those outsourced or manufactured by subcontractors.  The methods presented in this standard are intended to be applied at the level of assembly at which soldering occurs, i.e., circuit-card assembly level.

TechAmerica ANSI-GEIA-STD-0006 Standard: Requirements for Using Solder Dip to Replace the Finish on Electronic Components is a commercial standard defining the requirements for fully replacing undesirable surface finishes using a solder dip process.  Requirements for qualifying and testing the refinished piece parts are also included.  This standard covers the replacement of pure tin and lead-free (Pb-free) tin alloy finishes with tin-lead (SnPb) finishes.  This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this standard.  It covers process and testing requirements for robotic and semi-automatic dipping process but does not cover purely manual dipping processes, due to the lack of understanding of the appropriate requirements for hand-dipping for tin whisker mitigation at this time.  The intent of this standard is for suppliers and users to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control.  Each user shall determine the applicability of this standard and the need for full replacement of the existing termination finish.  This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping.  Some applications may have unique requirements that exceed the scope of this standard and should be specified separately.  Pb-free tin piece parts, which have been dipped in compliance with this standard, are no longer considered Pb-free tin finished for the purposes of GEIA-STD-0005-2.

TechAmerica GEIA-HB-0005-1 Bulletin: Program Manager's Handbook for Managing the Transition to Lead-Free Electronics in Aerospace and Military Systems is a commercial handbook providing guidance on lead-free electronics in aerospace and military systems.  This handbook is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance.  Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board finish, or assembly solder) if careful coordination between buyer and supplier is not exercised.  For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn/Pb)-finished piece part has been discontinued.  Detailed examination of piece parts and documents at receiving inspection while crucial may not be sufficient to identify Pb-free piece parts.