This volume is one of a two-volume series which sets forth the grounding, bonding, and shielding applications for communications electronics (C-E) equipment and facilities. Grounding, bonding, and shielding are complex subjects about which in the past there has existed a good deal of misunderstanding. The subjects themselves are interrelated and involve considerations of a wide range of topics from electro-chemistry and metallurgy to electromagnetic field theory and atmospheric physics. These two volumes reduce these varied considerations into a usable set of principles and practices which can be used by all concerned with, and responsible for, the safety and effective operation of complex C-E systems. Where possible, the principles are reduced to specific steps. Because of the large number of interrelated factors, specific steps cannot be set forth for every possible situation. However, once the requirements and constraints of a given situation are defined, the appropriate steps for solution of the problem can be formulated utilizing the principles set forth.
Both volumes (Volume I, Basic Theory and Volume II, Applications) implement the Grounding, Bonding, and Shielding requirements of MIL-STD-188-124A which is mandatory for use within the Department of Defense.
This handbook emphasizes the necessity for including considerations of grounding, bonding and shielding in all phases of design, construction, operation, and maintenance of electronic equipment and facilities. Volume I, Basic Theory, develops the principles of personnel protection, fault protection, lightning protection, interference reduction, and EMP protection for C-E facilities. In addition, the basic theories of earth connections, signal grounding, electromagnetic shielding, and electrical bonding are presented. The subjects are not covered independently, rather they are considered from the standpoint of how they influence the design of the earth electrode subsystem of a facility, the selection of ground reference networks for equipment and structures, shielding requirements, facility and equipment bonding practices, etc. Volume I also provides the basic background of theory and principles that explain the technical basis for the recommended practices and procedures, illustrates the necessity for care and thoroughness in implementation of grounding, bonding, and shielding; and provides supplemental information to assist in the solution of those problems and situations not specifically addressed.
In Volume II, Applications, the principles and theories, including RED/BLACK protection, are reduced to the practical steps and procedures which are to be followed in structural and facility development, electronic engineering, and in equipment development. These applications should assure personnel, equipment and structural safety, minimize electromagnetic interference (EMI) problems in the final operating system; and minimize susceptibility to and generation of undesirable emanations. The emphasis in Volume II goes beyond development to assembly and construction, to installation and checkout, and to maintenance for long term use.
