Transformative Materials

A newly-announced DARPA program is betting that unprecedented on-chip integration of workhorse electronic components, such as transistors and capacitors, with less-familiar magnetic components with names like circulators and isolators, will open an expansive pathway to more capable electromagnetic systems. The Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC), program will orchestrate research into miniaturized magnetic components with a goal of catalyzing chip-based innovations in radar and other radio frequency (RF) systems—and satisfying growing military and civilian demands for new ways to maneuver within the increasingly crowded electromagnetic spectrum.

Radio Frequency and mixed signal electronics face performance limitations due to the limited circuit complexity possible in typical high-speed/high-dynamic-range compound semiconductor integrated circuit technologies.

Dr. Daniel Green joined DARPA as a program manager in March 2013. His interests include advanced materials, devices and technology integration for electronic systems.