Showing 4 results for Interface
+ Complexity
08/14/2015
For millennia, materials have mattered—so much so that entire eras have been named for them. From the Stone Age to the Bronze Age to the Iron Age and beyond, breakthroughs in materials have defined what was technologically possible and fueled revolutions in fields as diverse as electronics, construction and medicine. Today, DARPA is pursuing the next big advances in this fundamentally important domain.
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04/22/2016
Advanced materials are increasingly embodying counterintuitive properties, such as extreme strength and super lightness, while additive manufacturing and other new technologies are vastly improving the ability to fashion these novel materials into shapes that would previously have been extremely costly or even impossible to create. Generating new designs that fully exploit these properties, however, has proven extremely challenging.
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May 13, 2016,
Executive Conference Center
The Defense Advanced Research Projects Agency (DARPA) Defense Sciences Office (DSO) is sponsoring a Proposers Day to provide information to potential proposers on the objectives of an anticipated Broad Agency Announcement (BAA) for the TRAnsformative DESign (TRADES) program. The Proposers Day will be held on Friday, May 13, 2016 from 8:30 AM to 12:30 PM (EDT) at the Executive Conference Center (4075 Wilson Blvd. Suite 350 Arlington, VA 22203).
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New manufacturing technologies such as additive manufacturing have vastly improved our ability to create shapes and material properties previously thought impossible. Generating new designs that fully exploit these properties, however, has proven extremely challenging. Conventional design technologies, representations, and algorithms are inherently constrained by outdated presumptions about material properties and manufacturing methods. As a result, today’s design technologies are simply not able to bring to fruition the enormous level of physical detail and complexity made possible with cutting-edge manufacturing capabilities and materials.
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