Showing 3 results for Integration
+ Tech-Foundations
07/19/2016
Open the hood of just about any electronic gadget and you probably will find one or more printed circuit boards (PCBs)—most often in a leaf green color—studded with processing, memory, data-relaying, graphics, and other types of chips and components, all interconnected with a labyrinth of finely embossed wiring. By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device the size of a single chip, DARPA’s newest program is making a bid to usher in a fresh dimension of technology miniaturization.
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September 21, 2016,
Westin Tysons Corner
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is sponsoring a Proposers Day to provide information to potential proposers on the objectives of an anticipated Broad Agency Announcement (BAA) for the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. The Proposers Day will be held on September 21, 2016, from 8:00 AM to 5:00 PM EDT at the Westin Tysons Corner in Falls Church, VA.
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12/16/2016
The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.
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