LED manufacturing investment declines as industry contemplates future directions
01/18/2013
Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak ...
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Samsung grabs No.3 foundry spot on smartphone dominance
01/17/2013
In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ...
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ISS 2013: Semiconductor leaders see massive industry transformation
01/15/2013
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in te...
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Look for 4K LCDs, OLEDs at CES
01/07/2013
As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over ...
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Novati to use Ziptronix bonding tech for 3D assembly
01/18/2013
Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking...
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IBM team wins Feynman Prize for scanning probe microscopy
01/17/2013
IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, ...
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World’s most complex 2d laser beamsteering array demonstrated
01/17/2013
DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantenn...
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Report: "Glaring imbalances" in printed electronics venture funding
01/17/2013
Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, though it's declined sharply since 2007. A new Lux Research report looks ...
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SRC, DARPA unveil university research center network
01/17/2013
Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA) announced that $194 million will be dedicated during the next five years to STARnet, whic...
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GlobalFoundries adding R&D facility to NY fab campus
01/11/2013
GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology deve...
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By the numbers: The rise of fabless IC sales, 1999-2010 and beyond
01/10/2013
Fabless IC suppliers saw sales rise 6% in 2012, again outperforming IDMs and the total IC market, and by 2017 fabless ICs will make up a full third of the overall market, says IC Insights.
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CES 2013: The brains behind smart devices are front and center
01/09/2013
Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports. |
Opinion: MEMS new product development, a sellable plan
01/09/2013
In David DiPaola's blog, he discuss the critical factors needed for success in the early stage of new MEMS product development. |
SEMI approves first HB-LED standards
01/09/2013
SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices. |
Innovations in computational lithography for 20nm
01/08/2013
Several innovations in computational lithography have been developed in order to squeeze every possible process margin out of the lithography/patterning process. In this blog, Gandha...
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Cymer hires AMAT roadmap exec to lead EUV development
01/08/2013
Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.
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2013: Advanced chemistry moves center stage
01/04/2013
We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore. |
IDC: Semiconductor revenues will grow 4.9% in 2013
01/04/2013
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% fr...
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SIA: November chip sales best of the year
01/04/2013
Global semiconductor sales in November 2012 were the largest monthly tally of the entire year,according to the SIA -- and growth was especially sparkling in the North America region.
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2013: Healthy revenue growth, but capex likely flat
01/04/2013
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particular...
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SK Hynix licensing Tessera, Invensas patents
01/03/2013
Korean DRAM maker SK Hynix has entered into new eight-year patent licensing agreements with Tessera Inc. and Invensas. |
2013: An economic outlook for the global IC market
01/03/2013
Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower...
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2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets
01/03/2013
Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes ...
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3D and 2.5D Integration: A Status Report Live EventThis webcast will explore the present status of 2.5 and 3D integration, including TSV formation. Sponsored by
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Automated Test Creation for Mixed Signal IP using IJTAG
The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embedded IP, the new IEE...
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Faster Time to Root Cause with Diagnosis-Driven Yield Analysis
This whitepaper describes the benefits of implementing a diagnosis-driven yield analysis flow using the Tessent® Diagnosis and Tessent YieldInsight® software products. ICs devel...
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NF-Shuttle: Standardizing the fabless MEMS Industry
In order for the MEMS industry to replicate the success of the CMOS fabless model, there is a need for a similar standardized process technology that can be leveraged by a bread...
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