NIST CNST NanoFab Equipment
Wet Chemistry
Certain commercial equipment, and software, are identified in this documentation to describe the subject adequately. Such identification does not imply
recommendation or endorsement by the NIST, nor does it imply that the equipment identified is necessarily the best available for the purpose.
|
|
This bench is used to etch and clean samples.
- 72" Open Wet Bench.
- Contains 2 dip tanks, two reflux quartz heated baths, glove rinse,
DI and N2 spray guns, GFCI 120 VAC receptacle, and two safety eyewash stations.
- Capable of handling small samples up to a full cassette of 6" wafers.
- Tank 1: Dip tank with lid (Buffered Oxide Etch-BOE)
- Tank 2: Reflux heated bath (RCA Standard Clean 1-SC1)
- Tank 3: Dip Tank with lid (2% HF)
- Tank 4: Dump Rinse with lid
- Tank 5: Reflux heated bath (RCA Standard Clean 2-SC2)
- It is located in an ultra-clean CMOS-compatible area and is subject to strict restrictions to prevent cross contamination.
Applications:
- This tool is used for the "RCA" cleaning of wafers to remove
organic and metallic surface contaminants.
- BOE to etch silicon dioxides
Demonstrated use:
Etching of patterned oxide; Contaminant removal; Wafer reclaim
|
|
|
|
This bench is used to etch and clean samples.
- 96" Open Wet Bench.
- Contains 4 dip tanks, 4 reflux quartz heated baths, glove rinse, DI and N2 spray guns,
GFCI 120 VAC receptacle, and two safety eyewash stations.
- Capable of handling small samples up to a full cassette of 6" wafers.
- Tank 1: Dip tank with lid (Buffered Oxide Etch-BOE).
- Tank 2: Reflux heated bath (RCA Standard Clean 1-SC1).
- Tank 3: Dip Tank with lid (2% HF).
- Tank 4: Dump Rinse with lid.
- Tank 5: Reflux heated bath (RCA Standard Clean 2-SC2).
- Tank 6 and 8: small volume dip tanks for 4" wafer cassettes and samples.
- Tank 7 and 9: small volume quartz heated baths for 4" wafers cassettes and samples.
Applications:
- This tool is used for the "RCA" cleaning of wafers to remove organic and metallic surface contaminants.
- BOE to etch silicon dioxides
Demonstrated use:
Demonstrated use:
Etching of patterned oxide; Contaminant removal; Wafer reclaim
|
|
|
|
These two tools are used for the DI water rinsing and spin-drying of the wafers after RCA cleaning.
- Cassettes for 3, 4 and 6" wafers
- Programmable recipes for rinse, quality rinse, purge and two dry cycles
|
|
|
KOH Wet Etch Bench: Reynoldstech |
Acid Etch Bench: Reynoldstech
|
Go to top of page
The National Institute of Standards and Technology (NIST) is an agency of the U.S. Department of Commerce.
Privacy policy / security notice / accessibility statement /
Disclaimer /
Freedom of Information Act (FOIA) /
Environmental Policy Statement /
No Fear Act Policy /
ExpectMore.gov (performance of federal programs) /
NIST Information Quality Standards /
Scientific Integrity Summary
Online: February 2006
Last Updated: February 2012
Contact Us:cnstwebmaster@nist.gov