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Interconnect Technology for High Temperature SiC Integrated Circuits

Award Information

Agency:
Department of Defense 		Branch:
Air Force 		Award ID:
32297 		Program Year/Program:
1996 / SBIR
Agency Tracking Number:
32297 		Solicitation Year:
N/A 		Solicitation Topic Code:
N/A 		Solicitation Number:
N/A
Small Business Information
Advanced Technologies/Laboratories Intl
Advanced Technologies/Lab Intl 20010 Century Blvd, Ste 500 Germantown, MD 20874 0111
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Woman-Owned: Yes
Minority-Owned: Yes
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1996
Title: Interconnect Technology for High Temperature SiC Integrated Circuits
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $100,000.00
 

Abstract:

Integration of many different devices on a single silicon carbide (SiC) substrate is necessary to realize the full potential of high temperature or high power devices for markets ranging from industrial and consumer to military systems to transportation power and control. Integration requires that the entire device package, individual devices, contacts and interconnect materials, be suitable for high temperature operation. High temperature operation exacerbates atomic diffusion and material migration, devices, contacts and interconnect materials must be designed to remain structurally and electrically stable over the expected life of the device. To date, no reports have been published detailing the long term stability of interconnect materials for SiC devices or integrated circuits at high temperatures. In Phase I we will explore the long term stability of interconnects in contact with the dielectric isolation layer. Our Phase II program will further develop the interconnects and optimize their deposition and patterning for use with high temperature circuits. In addition to their stability, we will examine interaction of the interconnects with ohmic and rectifying contacts and potential wire bonding materials. Phase III research and development will focus on further improvements in reproducibility, quality, and cost for implementation in commercial application specific integrated circuits.

Principal Investigator:

Ronald Redwing
2037941100

Business Contact:

Small Business Information at Submission:

Advanced Technology Materials
7 Commerce Drive Danbury, CT 06810

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No