NIST CNST NanoFab Equipment
Specialty Tools

Certain commercial equipment, and software, are identified in this documentation to describe the subject adequately. Such identification does not imply recommendation or endorsement by the NIST, nor does it imply that the equipment identified is necessarily the best available for the purpose.

A tool for alternatively coating single atomic layers layer by layer using saturative surface reactions. Both thermal and/or plasma processes are available.

• Precisely controlled ultra-thin and pin-hole free film
• Layer stacks
• Nano-structure or 3D structure coating.
  • Oxides: SiO₂, Al₂O₃, TiO₂, HfO₂
  • Nitrides: AlN, TiN
  • Metals: Ru

This system deposits conformal coatings of Parylene N or C. Parylene is applied at room temperature.

• The raw material dimer is vaporized under vacuum and heated to a gas which is pyrolized to cleave the dimer to its monomeric form. In the room temperature deposition chamber, the monomer gas deposits as a transparent polymer film.
• The thickness of coatings can range from the hundreds of angstroms to several tens of micrometers.
• Two chamber sizes accommodate substrates from millimeters across to a maximum of 31cm Dia. X 28cm H)

• These polymers are widely used in medical devices and for electronics and automotive application.
• Coatings are biocompatible and biostable and pinhole-free.
• Material provide moisture, chemical and dielectric barriers, as well as low coefficient of friction.

• Back substrate for polymer after delamination from wafer surface.
• Electrical isolation for submerged components

The new Suss wafer bonder works in conjunction with the Suss MA6 mask Aligner.

• Capable of 3", 4"and 6" wafer bonding
• Can use various substrate materials depending on bonding application
• User friendly Windows-based system
• There are several types of bonding capabilities available: Thermal Compression, Anodic, Eutectic, Glass Frit, Fusion, SOI, Adhesive, and Temporary