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Pavements

ISTEA of 1991, Section 6005(e)7, Thin Bonded Overlay and Surface Lamination (Pavements and Bridges)

BACKGROUND: Section 6005(a) established a new Applied Research and Technology Program. This section identifies specific technologies that are to be tested, evaluated, and implemented to improve the durability, efficiency, productivity, and safety of highway, transit, and intermodal transportation systems. Special funding was to be provided for the subject Section 6005(e)7, 6 year, $15 million effort.

The intent is to determine the feasibility, costs and benefits associated with the repair, rehabilitation, and upgrading of highway pavements and bridge decks with overlays or surface laminations. These projects are to be carried out to minimize overlay thickness, minimize initial laydown costs, minimize time out of service and maximize life cycle durability. Eligible project costs include construction of the thin bonded overlay or surface lamination and data collection and reporting necessary to evaluate the effectiveness of the treatments. The Federal share of the construction costs cannot exceed 80 percent. Technical assistance, testing, data collection, annual reporting, final reports. etc. were funded with 100 percent Sec. 6005 funds and require no State matching.

STATUS: An FHWA technical working group was established to direct this effort and to develop an implementation plan. The first phase of the plan was to locate potential sources of technology and systems for thin bonded overlays (including inorganic bonding systems) and surface lamination for pavements and bridge decks. An announcement, prepared by the working group, appeared in the Commerce Business Daily on August 26, 1992 and solicited industry's responses as to the availability of this technology. Five responses were received. This information was included with the initial February 23, 1993 request for projects. On July 1, 1994 a request was made for additional candidate projects. Construction on the candidate projects, once approved, were handled in accordance with existing Federal-aid procedures. Evaluation of the projects are conducted by work orders with the various State agencies. The projects must be on the federal aid system. As of September 30, 1997, the following is a summary of projects approved for the program:

Thin bonded overlays or surface laminates of Highway Pavements - Under this program, four 75 mm or 100 mm bonded overlays of CRCP and one 100 mm bonded inlay of a JPCP were approved in the States of VA, NC, IL, TX, and NE. In addition, eight whitetopping (PCC/AC) projects were approved in the States of SC, TN, VA, KS, IA, and MN (3). Also, two NOVACHIP surface laminate projects were approved in PA. Construction of all the projects is expected to be completed in 1997. Only minor distress has been reported on some of the projects except some delamination in one direction on the project in IL. In general, the projects appear to be performing very well so far and results are encouraging.

Thin bonded overlays or surface laminates of Bridge Decks - There was major interest in constructing bridge deck overlays as a part of this program. This reflects the corrosion problem on many existing bridge decks and the importance of using thin overlays to reduce dead loads on the bridges. Under this program, about 28 projects have been constructed or have been approved in the States of DE, ID(3), IL, KS(4), LA(2), MT, NC, NY, OH(2), OK, OR(3), TX(2), VA(2), WV(2), and WY(3). A wide variety of products including slag, silica fume, fibers, and corrosion inhibitors were tested. Very few construction and evaluation reports have been received for these projects at this time.

REPORTS AVAILABLE: A current status report was issued in September 1998, listing all projects constructed to date. A report summarizing the conclusions, recommendations and findings of the Thin Bonded Overlay program for both pavement and bridges will be completed in 1999.

CONTACTS: Mark Swanlund (202) 366-1323 pavement information, Vasant Mistry (202) 366-4599 for bridge information.

 
This page last modified on 05/31/06
 

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