www.OSHA.gov	A-Z Index: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Semiconductors: Silicon Device Manufacturing Processes and Related Hazards Semiconductor manufacturing includes four main operations: (1) Substrate manufacture, (2) Device fabrication, (3) Metallization, and (4) Non-Fabrication processing. The links below provide additional information on the various processes, related hazards, and controls for each of these operations. Where appropriate, additional links are provided to various topics contained in the OSHA Safety and Health Topics website. Information on this page is general; actual processes will vary with each production facility. A complete hazard inventory should be based on a hazard analysis of the actual process in question. Substrate Manufacture Polycrystalline Silicon Production Single Crystal Ingot Growth Ingot Evaluation and Machining Wafer Preparation Device Fabrication Oxidation Cleaning Photoresist Application Soft Bake Mask Alignment and Photoexposure Developing Hard Bake Etching Photoresist Stripping Doping (Junction Formation) Deposition Metallization Metal Deposition Photolithography Silyation Metal Etch Alloying and Annealing Passivation Backlapping and Backside Metallization Non-Fabrication Processing Wafer Sort and Test Die Separation Die Attach and Bonding Packaging and Encapsulation Definitions   Revised: 14 January 2004		Safety and Health  Topics        Semiconductors   Standards   Hazards and Controls   Additional Information   Credits
Back to Top www.osha.gov www.dol.gov Contact Us | Freedom of Information Act | Customer Survey Privacy and Security Statement | Disclaimers Occupational Safety & Health Administration 200 Constitution Avenue, NW Washington, DC 20210