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Comprehensive Tools to Assess Environmental Impacts of and Improve the Design of Semiconductor Equipment and Processes
Grant Number R831456
RFA: Technology for a Sustainable Environment (2003)

Other views: Selected publication types Journal articles Publications submitted after final report Redisplay this page with Reference Title, Journal, and Author Columns Display this page in RIS format

  • Presentation (5)
  • Proceedings (5)
    • Reference Type Citation Progress Report Year Document Sources
    Presentation Boyd S, Dornfeld D, Krishnan N, Moalem M. Environmental challenges for 45-nm and 32-nm node CMOS logic. Presented at the IEEE International Symposium on Electronics and Environment (ISEE), May 2007. R831456 (Final)
    		 not available
    Presentation Yuan C. A decision-based analysis of compressed air usage patterns in automotive manufacturing. Presented at the Ford Motor Company, Seminar, Dearborn, MI, April 27, 2005. R831456 (2005)
    R831456 (Final)
    		 not available
    Presentation Zhang TW, Bates SW, Dornfeld DA. Operational energy use of plasmonic imaging lithography. Presented at the IEEE International Symposium on Electronics and Environment (ISEE), May 2007. R831456 (Final)
    		 not available
    Presentation Zhang T, Boyd S, Vijayaraghavan A, Dornfeld D. Energy use in nanoscale manufacturing. Presented at the 2006 IEEE International Symposium on Electronics and Environment (ISEE), IEEE, San Francisco, May 2006. R831456 (Final)
    		 not available
    Presentation Zhang T, Dornfeld D. Energy use per worker-hour: evaluating the contribution of labor to manufacturing energy use. Presented at the 14th CIRP International Conference on Life Cycle Engineering, Waseda University, Tokyo, Japan, June 2007. R831456 (Final)
    		 not available
    Proceedings Boyd S, Dornfeld D, Krishnan N. Life cycle inventory of a CMOS chip. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, May 2006, pp. 253-257. R831456 (2005)
    R831456 (Final)
    		 not available
    Proceedings Boyd S, Dornfeld D, Krishnan N, Moalem M. Environmental challenges for 45-nm and 32-nm node CMOS logic. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and Environment, Orlando, FL, May 2007, pp. 102-105. R831456 (Final)
    		 not available
    Proceedings Zhang TW, Boyd S, Vijayaraghavan A, Dornfeld D. Energy use in nanoscale manufacturing. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and Environment, San Francisco, CA, May 2006, pp. 266-271. R831456 (Final)
    		 not available
    Proceedings Zhang TW, Bates SW, Dornfeld DA. Operational energy analysis of plasmonic imaging lithography. In: Electronics and the Environment, Proceedings of the 2006 IEEE International Symposium on Electronics and Environment, Orlando, FL, May 2007, pp. 99-101. R831456 (Final)
    		 not available
    Proceedings Zhang T, Dornfeld D. Energy use per worker-hour: evaluating the contribution of labor to manufacturing energy use. In: Proceedings of the 14th CIRP International Conference on Life Cycle Engineering, Waseda University, Tokyo, Japan, June 2007. R831456 (Final)
    		 not available

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