![[logo] US EPA](https://webarchive.library.unt.edu/eot2008/20090825045656im_/http://www.epa.gov/epafiles/images/logo_epaseal.gif){kind=logo}
Publications Details for:
Fundamental Understanding and Performance Enhancement of Conductive Adhesive for Microelectronic Packaging Applications
Grant Number R831489
RFA: Technology for a Sustainable Environment (2003)
| Reference Type | Citation | Progress Report Year | Document Sources |
|---|---|---|---|
| Book Chapter | Li Y, Yim MJ, Moon K, Wong CP. Electrically conductive adhesives. In:Schwartz M, ed. Smart Materials. Boca Raton, FL: CRC Press, 2008, pp. 11-12 - 11-25. |
R831489 (Final) |
|
| Journal Article | Dong H, Moon KS, Wong CP. Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. Journal of Electronic Materials 2004;33(11):1326-1330 |
R831489 (2004) |
not available |
| Journal Article | Dong H, Zhang ZQ, Wong CP. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. Journal of Adhesion Science and Technology 2005;19(2):87-94 |
R831489 (2004) R831489 (2005) |
not available |
| Journal Article | Dong H, Moon KS, Wong CP. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. Journal of Electronic Materials 2005;34(1):40-45 |
R831489 (2004) R831489 (2005) |
not available |
| Journal Article | Dong H, Meininger A, Jiang H, Moon K-S, Wong CP. Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. Journal of Electronic Materials 2007;36(5):593-597. |
R831489 (2007) |
|
| Journal Article | Dong H, Li Y, Yim MJ, Moon KS, Wong CP. Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. Applied Physics Letters 2007;90(9):092102, 3 pp. |
R831489 (2006) R831489 (2007) |
|
| Journal Article | Jiang HJ, Moon KS, Lu J, Wong CP. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. Journal of Electronic Materials 2005;34(11):1432-1439. |
R831489 (2005) |
not available |
| Journal Article | Jiang H, Moon K, Li Y, Wong CP. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chemistry of Materials 2006;18(13):2969-2973. |
R831489 (2006) |
|
| Journal Article | Jiang HJ, Moon KS, Zhang ZQ, Pothukuchi S, Wong CP. Variable frequency microwave synthesis of silver nanoparticles. Journal of Nanoparticle Research 2006;8(1):117-124 |
R831489 (2004) R831489 (2005) |
not available |
| Journal Article | Jiang H, Moon K, Hua F, Wong CP. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chemistry of Materials 2007;19(18):4482-4485. |
R831489 (2007) |
|
| Journal Article | Jiang H, Zhu L, Moon K-S, Wong CP. The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. Carbon 2007;45(3):655-661. |
R831489 (2007) |
|
| Journal Article | Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A. Tin/indium nanobundle formation from aggregation or growth of nanoparticles. Journal of Naonoparticle Research 2008;10(1):41-46. |
R831489 (Final) |
|
| Journal Article | Li Y, Moon KS, Wong CP. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials 2005;34(3):266-271. |
R831489 (2005) |
not available |
| Journal Article | Li Y, Moon KS, Wong CP. Materials science. Electronics without lead. Science 2005;308(5727):1419-1420. |
R831489 (2005) |
not available |
| Journal Article | Li Y, Moon KS, Wong CP. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties. Journal of Electronic Materials 2005;34(12):1573-1578. |
R831489 (2005) |
not available |
| Journal Article | Li Y, Xiao F, Moon KS, Wong CP. Novel curing agent for lead-free electronics: amino acid. Journal of Polymer Science Part A: Polymer Chemistry 2005;44(2):1020-1027. |
R831489 (2005) R831489 (2006) |
not available |
| Journal Article | Li Y, Moon KS, Wong CP. Reliability improvement of conductive adhesives on tin (Sn) surfaces. Journal of Adhesion Science and Technology 2005;19(16):1427-1444. |
R831489 (2005) |
not available |
| Journal Article | Li Y, Moon KS, Wong CP. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Transactions on Components and Packaging Technologies 2006;29(1):173-178. |
R831489 (2005) R831489 (2006) |
|
| Journal Article | Li Y, Moon KS, Wong CP. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. Journal of Applied Polymer Science 2006;99(4):1665-1673. |
R831489 (2005) R831489 (2006) |
|
| Journal Article | Li Y, Moon KS, Whitman A, Wong CP. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE Transactions on Components and Packaging Technologies 2006;29(4):758-763. |
R831489 (2006) |
|
| Journal Article | Li Y, Wong CP. High performance anisotropic conductive adhesives for lead-free interconnects. Soldering & Surface Mount Technology 2006;18(2)33-39. |
R831489 (2006) |
|
| Journal Article | Li Y, Wong CP. Monolayer protection for eletrochemical migration control in silver nanocomposite. Applied Physics Letters 2006;89(11):112112, 3 pp. |
R831489 (2006) |
|
| Journal Article | Li Y, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering R: Reports 2006;51(1-3):1-35. |
R831489 (2005) R831489 (2006) |
|
| Journal Article | Li Y, Yim MJ, Wong CP. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials 2007;36(5):549-554. |
R831489 (2007) |
|
| Journal Article | Li Y, Xiao F, Wong CP. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. Journal of Polymer Science Part A: Polymer Chemistry 2007;45(2):181-190. |
R831489 (2006) R831489 (2007) |
|
| Journal Article | Li Y, Yim MJ, Moon KS, Wong CP. Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. IEEE Transactions on Advanced Packaging 2009;32(1):123-129. |
R831489 (Final) |
|
| Journal Article | Moon KS, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. Journal of Electronic Materials 2005;34(2):168-175. |
R831489 (2005) |
not available |
| Journal Article | Moon KS, Li Y, Xu JW, Wong CP. Lead-free interconnect technique by using variable frequency microwave. Journal of Electronic Materials 2005;34(7):1081-1088 |
R831489 (2004) R831489 (2005) |
not available |
| Journal Article | Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. Journal of Electronic Materials 2007;36(10):1341-1347. |
R831489 (2007) |
|
| Journal Article | Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. Journal of Adhesion Science and Technology 2008;22(14):1593-1630. |
R831489 (Final) |
|
| Journal Article | Chiang HW, Chung C-L, Chen LC, Li Y, Wong CP, Fu SL. Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Journal of Adhesion Science and Technology 2005;19(7):565-578. |
R831489 (2005) |
not available |
| Presentation | Dong H, Fan L, Moon KS, Wong CP, Baskes MI. Molecular dynamics simulation of lead free solder for low temperature reflow applications. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2005) |
not available |
| Presentation | Jiang H, Moon KS, Wong CP. Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials. Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2005) |
not available |
| Presentation | Jiang H, Moon KS, Zhu L, Lu J, Wong CP. The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite. Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2005) |
not available |
| Presentation | Jiang H, Moon K, Wong CP. Tin/silver/copper alloy nanoparticles pastes for low temperature lead-free interconnect applications. Presented at the IEEE 58th Electronic Components & Technology Conference, Orlando, FL, May 27-30, 2008. |
R831489 (2007) |
not available |
| Presentation | Jiang H, Yim M, Moon K, Li Y, Wong CP. Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects. Presented at the IEEE 58th Electronic Components & Technology Conference, Orlando, FL, May 27-30. |
R831489 (2007) |
not available |
| Presentation | Jiang H, Moon K, Zhang R, Wong CP. In situ reduced silver nanoparticles for highly conductive anisotropic conductive films applications. Presented at the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, 2008. |
R831489 (Final) |
not available |
| Presentation | Li Y, Moon K, Wong CP. Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2005) |
not available |
| Presentation | Li Y, Whitman A, Moon K, Wong CP. High performance electrically conductive adhesives (ECAs) modified with novel aldehydes. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2005) |
not available |
| Presentation | Li Y, Wong CP. Nano-Ag filled anisotropic conductive adhesives (ACA) with self-assembled monolayer for high performance fine pitch interconnect. Presented at the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2005) |
not available |
| Presentation | Li Y, Moon K, Wong CP. Stabilizing contact resistance of conductive adhesives on Sn Surface by novel corrosion inhibitors. Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2005) |
not available |
| Presentation | Li Y, Yim M, Moon KS, Wong CP. High performance non-conductive film (NCF) with conjugated molecular wires. Presented at the 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007 (abstract pp. 140-144). |
R831489 (2007) |
not available |
| Presentation | Li Y, Wong CP. Amino acid as a novel curing agent for epoxy in electronic materials [#227 in Nanotechnology and the Environment (I&EC)]. Presented at the 231st ACS National Meeting, Atlanta, GA, March 26-30, 2006. |
R831489 (2006) |
not available |
| Presentation | Li Y, Wong CP. Effects of surface chelating on corrosion control in electronic packaging [#198 in Advanced Materials for Microelectronic Packaging (I&EC)]. Presented at the 231st ACS National Meeting, Atlanta, GA, March 26-30, 2006. |
R831489 (2006) |
not available |
| Presentation | Li Y, Wong CP. High performance environmental friendly nano-composite for lead-free interconnect [#515 in Polymers in Microelectronics and Optoelectronics (PMSE)]. Presented at the 231stACS National Meeting, Atlanta, GA, March 26-30, 2006. |
R831489 (2006) |
not available |
| Presentation | Li Y, Moon K, Wong CP. Improvement of electrical performance of anisotropically conductive adhesives (ACA). Presented at the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2005) |
not available |
| Presentation | Zhang RW, Moon KS, Lin W, Jiang HJ, Wong CP. Incorporation of self-assembly molecular wires into anisotropic conductive adhesive for high performance interconnection applications. Presented at the 10th Electronic Packaging Technology Conference, Singapore, 2008. |
R831489 (Final) |
not available |
| Presentation | Zhang RW, Wei W, Moon KS, Jiang HJ, Lin W, Wong CP. Development of transparent and flexible electrically conductive adhesives for microelectronics applications. Presented at the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, 2008. |
R831489 (Final) |
not available |
| Presentation | Zhang R, Li Y, Moon K, Wong CP. Electrically conductive adhesive with pi-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties. Presented at the IEEE 58th Electronic Components & Technology Conference, Orlando, FL, May 27, 2008. |
R831489 (2007) |
not available |
| Proceedings | Jiang H, Yim M, Moon KS, Wong CP. Novel nonconductive adhesives/films with carbon nanotubes for high performance interconnects. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1385-1389. |
R831489 (Final) |
not available |
| Proceedings | Jiang H, Moon K, Wong CP. Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1400-1404. |
R831489 (Final) |
not available |
| Proceedings | Jiang H, Moon K, Li Y, Wong CP. Ultra high conductivity of isotropic conductive adhesives. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 485-490. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Moon K, Wong CP. Stabilizing contact resistance of adhesives on Sn surface by novel corrosion inhibitors. In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2004) |
not available |
| Proceedings | Li Y, Moon K, Wong CP. Development of conductive adhesives with novel corrosion inhibitors for stabilizing contact resistance on non-noble lead-free finishes. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2004) |
not available |
| Proceedings | Li Y, Whitman A, Moon K, Wong CP. High performance electrically conductive adhesives (ECAs) modified with novel aldehydes. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2004) |
not available |
| Proceedings | Li Y, Moon K, Wong CP. Improvement of electrical performance anisotropically conductive adhesives (ACA). In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2004) |
not available |
| Proceedings | Li Y, Wong CP. Nano-Ag filled anisotropic conductive adhesives with self-assembled monolayer for high performance fine pitch. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2004) |
not available |
| Proceedings | Li Y, Yim MJ, Moon K, Wong CP. Nano-scale conductive films with low temperature sintering for high performance fine pitch interconnect. In: Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, NV, May 29-June 1, 2007, pp.1350-1355. |
R831489 (2007) |
not available |
| Proceedings | Li Y, Yim MJ, Wong CP. Novel monolayer-enhanced non-conductive film (NCF) for ultra-fine pitch high performance interconnect in lead-free electronics. In:Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, NV, May 19-June 1, 2007, pp.1911-1915. |
R831489 (2007) |
not available |
| Proceedings | Li Y, Yim MJ, Moon K, Zhang RW, Wong CP. Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30, 2008, pp. 1272-1276. |
R831489 (Final) |
not available |
| Proceedings | Li Y, Xiao F, Moon K, Wong CP. A novel environmentally friendly and biocompatible curing agent for lead-free electronics. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1639-1644. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Wong CP. A novel non-migration nano-Ag conductive adhesive with enhanced electrical and thermal properties via self-assembled monolayers modification. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 924-931. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Moon K, Wong CP. Effects of reducing agents on the electrical properties of electrically conductive adhesives. In: Proceedings of the 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, Atlanta, GA, March 15-17, 2006, pp. 179-183. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Wong CP. High performance conductive adhesives for lead-free interconnects. In: Proceedings of the 2006 Materials Research Society (MRS) Fall Meeting [Symposium V, Advanced Electronics Packaging], Boston, MA, November 27-December 1, 2006. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Moon K, Wong CP. Novel lead free nano-scale non-conductive adhesive (NCA) for ultra-fine pitch interconnect applications. In: Proceedings of the 56th Institute of Electrical and Electronics Engineers (IEEE) Electronic Components and Technology Conference, San Diego, CA, May 30-June 2, 2006, pp. 1239-1245. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Moon K, Wong CP. Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications. In: Proceedings of the 2006 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Electronics and the Environment, San Francisco, CA, May 8-11, 2006, pp. 32-27. |
R831489 (2006) |
not available |
| Proceedings | Li Y, Wong CP. Silver migration control in electrically conductive adhesives. In: Proceedings of the 8th Institute of Electrical and Electronics Engineers (IEEE) Components, Packaging and Manufacturing Technology (CPMT) International Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’06), Shanghai, China, June 27-30, 2006, pp. 206-212. |
R831489 (2006) |
not available |
| Proceedings | Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancements of copper-filled electrically conductive adhesives for electronic packaging and interconnection. In: Proceedings of the 57th Electronics Components and Technology Conference, Reno, NV, May 29-June 1, 2007, pp. 82-88. |
R831489 (2007) |
not available |
| Proceedings | Zhang RW, Moon KS, Lin W, Wong CP. ACA bonding with enhanced electrical properties for microelectronic packaging applications. In:Proceedings of the IEEE 59th Electronic Components Technology Conference, San Deigo, CA, May 2009 (in press, 2009). |
R831489 (Final) |
not available |
| Proceedings | Zhang RW, Wong CP. Development of advanced interconnect materials for ink-jet printing by low temperature sintering. In:Proceedings of the IEEE 59th Electronic Components Technology Conference, San Diego, CA, May 2009 (in press, 2009). |
R831489 (Final) |
not available |
| Proceedings | Zhang RW, Duan YQ, Lin W, Moon KS, Wong CP. Transparent and flexible ECAs for electronic packaging and interconnect applications. In:Proceedings of the IEEE 59th Electronic Components Technology Conference, San Diego, CA, May 2009 (in press, 2009). |
R831489 (Final) |
not available |
| Proceedings | Zhang R, Li Y, Yim MJ, Moon KS, Lu DD, Wong CP. Electrically conductive adhesive with π-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties. In: Proceedings of the IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, FL, May 27-30 2008, pp.1913-1918. |
R831489 (Final) |
not available |
| Proceedings | Jiang H, Moon K-S, Zhu L, Lu J, et al. Role of self-assembled monolayer (SAM) on Ag nanoparticles for nanocomposite. In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2004) |
not available |
| Proceedings | Jiang H, Moon K-S, Wong CP. Synthesis of Ag-Cu nanoparticles for lead-free interconnect materials. In: Proceedings of the Institute of Electrical and Electronics Engineers 10th International Symposium on Advanced Packaging Materials, Beckman Center of the National Academies, Irvine, CA, March 16-18, 2005. |
R831489 (2004) |
not available |
| Proceedings | Dong H, Fan L, Moon K-S, Wong CP, et al. Dynamics simulation of lead free solder for low temperature applications. In: Proceedings of the 55th Institute of Electrical and Electronics Engineers Electronic Components and Technology Conference, Lake Buena Vista, FL, May 31-June 3, 2005. |
R831489 (2004) |
not available |