Journal Publications Details for:
Removal of Photoresist and Post-Plasma Etch Sidewall Films Using Superciritical and Subcritical CO2 with Additives
Grant Number R829554
RFA: Technology for a Sustainable Environment (2001)
Reference Type | Citation | Progress Report Year | Document Sources |
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Journal Article | Levitin G, Myneni S, Hess DW. Reactions between CO2 and tetramethylammonium hydroxide in cleaning solutions. Electrochemical and Solid State Letters 2003;6(8):G101-G104. |
R829554 (2002) R829554 (2003) |
not available |
Journal Article | Levitin G, Bush D, Eckert CA, Hess DW. Phase behavior and modeling of CO2/methanol/tetramethylammonium bicarbonate and O2/methanol/tetramethylammonium bicarbonate/water mixtures at high pressures. Journal of Chemical Engineering & Data 2004;49(3):599-606. |
R829554 (2003) |
not available |
Journal Article | Levitin G, Myneni S, Hess DW. Post plasma etch residue removal using CO2-TMAHCO(3) mixtures: Comparison of single-phase and two-phase mixtures. Journal of the Electrochemical Society 2004;151(6):G380-G386 |
R829554 (2002) R829554 (2003) R829554 (Final) |
not available |
Journal Article | Levitin G, Hess DW. Ionic conductivity of elevated pressure TMAHCO(3)/MeOH/CO2 mixtures. Electrochemical and Solid State Letters 2005;8(1):G23-G26 |
R829554 (Final) |
not available |
Journal Article | Myneni S, Hess DW. Post-plasma-etch residue removal using CO2-based fluids. Journal of the Electrochemical Society 2003;150(12):G744-G750 |
R829554 (Final) |
not available |
Journal Article | Myneni S, Peng H-G, Gidley DW, Hess DW. Compatibility of High Pressure Cleaning Mixtures with a Porous Low Dielectric Constant Film: A positronium Annihilation Lifetime Spectroscopic Study. Journal of Vacuum Science and Technology B 2005;.23(4): 1463. |
R829554 (Final) |
not available |
Journal Article | Petkov MP, Weber MH, Lynn KG, Rodbell KP. Porosity characterization by beam-based three-photon positron annihilation spectroscopy. Applied Physics Letters 2001;79(23):3884-3886 |
R829554 (Final) |
not available |