Form 9.B Project Summary

Chron: 971858

Proposal Number: 20.11-7351

Project Title: Electromechanical Systems for Spacecraft

Technical Abstract (Limit 200 words)

Individual modules or their combination will be targeted for multiple payload instrument platforms, spacecraft laser communications, and imagers on-board low cost constellation-type satellite busses. Further applications will be in positioning and vibration suppression enhancements to a microprecision vibration isolation product introduced recently for semiconductor manufacturing equipment.

A family of modular electromechanical mounting components for jitter suppression and microprecision pointing on satellites is proposed. The component family incorporates passive vibration isolation, active vibration isolation and suppression, and multiple-axis pointing. These devices will require little or no customization for incorporation early in or late in the payload and spacecraft design cycles, and will be suitable for use by either an instrument developer or a satellite payload integrator. A simple standard mechanical interface and overall component family characteristics will be selected based on a review of existing and predicted needs. The review will address the number of degrees of freedom of isolation and pointing required, and the overall restrictions on mount geometry. The vibration mitigation mounting system will support either vibration-generating or vibration-sensitive components. It will employ zero outgassing passive magnetic technology and piezoelectric actuators. The Phase I effort will include requirements definition, conceptual design, simulation of

satellite-instrument jitter and pointing characteristics, and build and test of a single-axis prototype mount. Phase II will develop the family of devices further with the goal of producing flight qualified hardware for use in a specific NASA instrument mounting application.

Potential Commercial Applications (Limit 200 words)

Individual modules or their combination will be targeted for multiple payload instrument platforms, spacecraft laser communications, and imagers on-board low cost constellation-type satellite busses. Further applications will be in positioning and vibration suppression enhancements to a microprecision vibration isolation product introduced recently for semiconductor manufacturing equipment.

Name and Address of Principal Investigator (Name,

Organization Name, Mail Address, City/State/Zip)

Eric H. Anderson

CSA Engineering, Inc.

2850 W. Bayshore

Palo Alto , CA 94303

Name and Address of Offeror (Firm Name, Mail Address,

City/State/Zip)

Conor D. Johnson

CSA Engineering, Inc.

2850 W. Bayshore

Palo Alto , CA 94303