Project Title:

A Network/Bus Transceiver with Multi-Channel Fiber Optic Interconnects

94-1		0603		0200

A Network/Bus Transceiver with Multi-Channel Fiber Optic 
Interconnects

Abstract:

This Small Business Innovation Research Phase I project proposes 
the development of multi-chip modules (MCMs) that incorporate 
ultra-fast optical fiber interfaces. This technology is critical 
for the next step toward high speed network/bus interconnects. 
Space-borne systems in particular require small, light-weight 
modules, where the capability to interface multiple channels 
efficiently at low cost is critical. Currently, packaging of 
optical transmitter and receiver components is very expensive 
relative to typical electronic IC packaging costs. Our approach 
targets chip-level designs that are amenable to large volume low 
cost production, while focusing on both conventional and advanced 
MCM state-of-the-art practices. For this effort, we propose the 
development of an MCM transceiver module for speeds near OC-48 
(2.5 Gbps). The chief attributes of the module are: (1) Use of 
advanced MCM substrate materials, silicon and diamond. (2) Use of 
silicon planar optical waveguides for simultaneous alignment of 
laser transmitter and detector receiver arrays, and for targeting 
low cost production. (3) Use of similar MCM and optical waveguide 
substrate materials for integration compatibility. (4) Designs 
based on modularized optical and electrical components.

A wide range of opportunities exist for our ultra-wide bandwidth 
transceiver MCMs. Supercomputer manufacturers are continuously 
searching for new and faster technologies. Additionally, local 
and metropolitan area networks will need new and faster interface 
devices. Therefore, we intend to take advantage of this growing 
market by introducing cost-effective higher bandwidth systems.

Key Words

Optivision, Inc.
4009 Miranda Ave.
Palo Alto, CA 94304