Project Title:

High Resolution, Low Taper Excimer Laser Machining of Thick

Resonetics, Inc.
4 Bud Way, Bldg. 21
Nashua, NH 03063

93-1-08     32   6772

High Resolution, Low Taper Excimer Laser Machining of Thick
Materials

Abstract:

Excimer lasers have been used commercially in manufacturing
environments for only about four years. Their utility lies in the
short wavelength and high resolution of the output, making it
possible to realize both high resolution features and high aspect
ratios, with very precise control over the machining process. An
optimization of process parameters is needed, however, before
many potential commercial applications can be realized. The goal
of this program is to completely investigate all of the necessary
parameters affecting the ability to use the excimer laser to
develop high aspect ratio, low taper angle, high resolution
features in metals as applied to NASA's current need for high
energy radiation collimators. Also, we will deliver
representative samples to prove the concept, necessary for Phase
II continuation, under which we will fabricate the end product
based on Phase I studies. It is anticipated that this study will
have great benefit for commercialization of other materials
processing applications.

The development of methods for machining thick materials with the
excimer laser, including metals, polymers and other inorganics
such as diamond and ceramics, will lead to an understanding of
how to use the beneficial characteristics of Excimer photons in
new ways and on new materials. Besides the obvious benefit to
high energy particle Physicists, commercial applications include
diamond cutting, print head fabrication and fiber optic
connectors.

Excimer lasers, Micromachining, U.V. Technology, High Energy
Particle Collimators