Project Title:

Thermographic Stress Analysis and NDE via Focal Plane Array Detectors

04.09-8120
900334
Thermographic Stress Analysis and NDE via Focal Plane Array Detectors

Abstract:

This innovation will advance the state of the art and practical capabilities of thermographic
stress analysis (TSA) and nondestructive evaluation (NDE) to investigate and predict
the mechanical behaviors of models and real structures. A benchmarking method will
be established to optimize stress resolution and speed of imaging. A new TSA/NDE
system based on focal plane array detectors will be designed and analytically evaluated.
The objectives are to quantify the net capability of any existing or proposed TSA/NDE
instrument, estimate the expected improvement of the proposed system over current
ones, and create the preliminary design of an instrument with high stress resolution
and speed. The anticipated results of Phase I work will include a prototype benchmarking
instrument that will aid in determining the feasibility of the new TSA/NDE instrument.
The prototype of the new device will be made during Phase II, aiming for NASA applications
in basic material studies (monolithics and composites; wide range of temperatures),
and quantitative, stress-based NDE and life prediction of machines and structures.
The method will be capable of full-field, noncontacting analysis of objects loaded
sinusoidally or self-excited, such as engines.
The new TSA/NDE device will be commercialized by production and sale of standardized
or customized hardware and software and by contractual testing of materials, components,
machines and structures.
thermographic stress analysis, thermoelasticity, NDE, focal plane arrays