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Class Numbers & Titles | Class Numbers Only | USPC Index | International | HELP |
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Class 148 | METAL TREATMENT |
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95 | PROCESS OF MODIFYING OR MAINTAINING INTERNAL PHYSICAL STRUCTURE (I.E., MICROSTRUCTURE) OR CHEMICAL PROPERTIES OF METAL, PROCESS OF REACTIVE COATING OF METAL AND PROCESS OF CHEMICAL-HEAT REMOVING (E.G., FLAME-CUTTING, ETC.) OR BURNING OF METAL |
96 | Superconductive metal or alloy (i.e., superconductive Tc at or below 30`K) |
97 | Particle (e.g., ion, neutron, etc.) bombardment or electromagnetic wave energy (e.g., laser, etc.) |
98 | Producing or treating an A3B (e.g., Nb3Sn, V3Ga, Nb3Al, etc.) superconducting alloy |
99 | Treating in extraterrestrial environment (e.g., space, moon, etc.) or zero gravity environment |
100 | Magnetic materials |
101 | Permanent magnet |
104 | Dust cores |
105 | Particulate material |
108 | Treatment in a magnetic field |
110 | Silicon steel |
120 | Working |
121 | Heat treatment |
194 | Chemical-heat removing (e.g., flame-cutting, etc.) or burning of metal |
195 | Control responsive to sensed condition of workpiece |
196 | Program or pattern control |
197 | Utilizing fluid contact other than flame |
198 | With solid additive |
200 | Of edge or corner (e.g., deburring, etc.) |
201 | Cylindrical workpiece |
202 | Scarfing (e.g., desurfacing, planing, gouging, etc.) |
204 | Flame piercing |
205 | Plural nozzles or plural work-contacting jets |
206 | Carburizing or nitriding using externally supplied carbon or nitrogen source |
207 | Carburizing or nitriding uniformly throughout the entire mass (i.e., internal carburizing) |
208 | With decarburizing or denitriding |
209 | Utilizing particulate fluid bed |
210 | Of selected surface area (e.g., zone, top only, etc.) |
211 | With working, machining, or cutting |
212 | Nitriding |
213 | Utilizing attached protective shield, mask or coating |
215 | Measuring, sensing, or testing |
217 | With noncarburizing or non-nitriding reactive coating (e.g., oxidizing, siliconizing, boronizing, etc.) |
218 | Combined carburizing and nitriding (e.g., carbonitriding, nitrocarburizing, etc.) |
220 | With producing or treating of workpiece having plural noncarburized or non-nitrided layers or mechanically engaged article or stock |
221 | With casting or solidifying from melt |
222 | Utilizing ionized gas (e.g., plasma, etc.) or electron arc or beam |
223 | Including use of vacuum |
224 | Utilizing wave energy (e.g., laser, etc.) or electric heating with work as conductor |
225 | Iron(Fe) or iron base alloy |
226 | With working, machining, or cutting |
227 | Utilizing fused agent or media |
230 | Nitriding |
231 | Utilizing nitrogen containing agent other than ammonia or elemental nitrogen |
232 | With post-nitriding heat or quenching |
233 | With post-carburizing heating or quenching |
234 | Utilizing agent containing cyano (CN) radical or halogen (X) radical or metal carbonate |
235 | Utilizing hydrocarbon, oil or oxygenated hydrocarbon (e.g., alcohol, furan, carbohydrate, etc.) |
236 | Utilizing solid carbonaceous material containing free carbon, coal, peat, or coke |
237 | Refractory metal (i.e., Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W) or refractory base alloy |
238 | Nitriding |
239 | With ion implantation |
240 | Processes of coating utilizing a reactive composition which reacts with metal substrate or composition therefore |
241 | Testing or electrical or wave energy utilized |
242 | Molten bath or molten surface utilized during reaction |
243 | Liquid reactive coating composition utilized |
244 | Dye or organic pigment containing |
245 | Electrically insulating coating formed which is more than mere oxide formation |
246 | Contains lubricant or oil or overcoat thereof |
247 | Contains an atom of hafnium, titanium or zirconium (excludes activating composition) |
248 | Contains nonreactive organic liquid at ambient temperature (e.g., solvent, etc.) |
250 | Contains organic phosphorus or organic chromium compound |
251 | Contains solid synthetic polymer |
252 | Contains dicarboxylic acid or salt thereof which reacts with metal substrate |
253 | Contains phosphorus |
254 | Liquid composition applied prior to reaction of metal substrate with phosphorus (e.g., cleaning, activating, etc.) |
255 | With additional coating composition containing an atom of chromium, phosphorus or sulfur |
256 | Specified liquid or gaseous coating composition applied after reaction with phosphorus |
258 | Contains an atom of chromium |
259 | Contains organic additive other than for pH control |
261 | Contains an atom of arsenic, boron or metal atom other than alkali metal |
264 | Contains an atom of chromium |
265 | Post chromium treatment with specified material (other than mere air drying) |
266 | Contains an atom of sulfur, selenium or tellurium |
267 | Contains trivalent chromium ion or reducing agent or an organic additive |
268 | Contains an atom or boron, silicon or metal atom other than alkali metal |
269 | Metal substrate contains elemental Ti, Zr, Hf, Cu, Ta, or Th or alloy thereof |
270 | Contains an atom of sulfur, selenium or tellurium |
272 | Coating or treating a metal oxide with a specified composition |
273 | Contains an atom of arsenic or metal atom other than alkali metal |
274 | Contains organic material |
275 | Metal substrate contains elemental aluminum or magnesium or alloy thereof |
276 | Coating during or after metal oxide formation |
277 | Metal oxide formed after applied coating |
278 | Carbide formation, decarburization or carbonizing |
279 | Contains an atom of boron or silicon that reacts with metal substrate |
280 | Reactive material applied nonuniformly or reacted selectively |
281 | Metal substrate contains elemental Ti, Zr, Nb, Ag, Ta, or W or alloy thereof |
282 | Metal substrate contains elemental copper or alloy thereof |
283 | Contains an atom of halogen, organic material or gaseous sulfur |
284 | Coating composition applied forms oxide coating |
500 | Utilizing disclosed mathematical formula or relationship |
501 | Nonferrous metal, nonferrous based alloy or no-base alloy |
503 | Utilizing therein symbol for temperature |
505 | Utilizing therein factors or percentages related to metal or metal alloy composition (i.e., including carbon content) |
508 | With measuring, testing, or sensing |
509 | Magnetic or electrical property |
510 | Change in dimension (e.g., expansion, elongation, distortion, etc.) |
511 | Temperature |
512 | Surface melting (e.g., melt alloying, etc.) |
513 | Treating loose metal powder, particle or flake |
514 | Treating consolidated metal powder, per se (i.e., no sintering or compacting step present) |
515 | With explosive or exothermic agent |
516 | Producing or treating layered, bonded, welded, or mechanically engaged article or stock as a final product |
517 | Subambient temperature |
518 | With electrocoating (e.g., electroplating, anodizing, sputtering, etc.) |
519 | Pipe or tube |
522 | With casting or solidifying from melt |
524 | With metal fusion bonding step utilizing electron arc or beam |
525 | Utilizing wave energy (e.g., laser, electromagnetic wave energy, etc.), plasma or electron arc or beam |
526 | Electric heating with work as electrical conductor (e.g., alternating current, induction, etc.) |
527 | With metal next to or bonded to metal |
528 | With brazing or soldering |
529 | Iron(Fe) or iron base alloy present |
530 | Next to nonferrous metal or nonferrous base alloy |
531 | Aluminum(Al) or aluminum base alloy |
532 | Copper(Cu) or copper base alloy |
533 | Zinc(Zn), zinc base alloy or unspecified galvanizing |
534 | With working |
535 | Aluminum(Al) or aluminum base alloy present |
536 | Copper(Cu) or copper base alloy |
537 | With coating step |
538 | With casting or solidifying from melt |
539 | Centrifugal casting |
540 | Iron(Fe) or iron base alloy |
541 | Continuous casting |
542 | Containing at least nine percent chromium(Cr) (e.g., stainless steel, etc.) |
543 | Containing at least 1.5 percent carbon |
544 | With working |
545 | With tempering, ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening, or quenching |
546 | With working |
547 | With tempering, ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening, or quenching |
548 | With tempering, ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening, or quenching |
549 | Aluminum(Al) or aluminum base alloy |
553 | Copper(Cu) or copper base alloy |
555 | Nickel(Ni) or nickel base alloy |
557 | With working |
558 | With vibration (e.g., mechanical, sound, etc.) |
559 | Heating or cooling of solid metal |
560 | Actinide or trans-actinide metal or alloy having greater than 50 percent actinide or trans-actinide metals |
561 | Passing through an amorphous state or treating or producing an amorphous metal or alloy |
562 | Treating single crystal |
563 | Mechanical memory (e.g., shape memory, heat-recoverable, etc.) |
564 | Superplastic (e.g., dynamic recrystallization, etc.) |
565 | Utilizing wave energy (e.g., laser, electromagnetic, etc.) plasma or electron arc or beam |
566 | Electric heating with work as conductor (e.g., alternating current, induction, etc.) |
567 | Induction |
568 | Wire or filament |
569 | Railway stock (e.g., rails, wheels, axles, etc.) |
570 | Of hollow bodies (e.g., pipe, sphere, etc.) |
572 | Rod, axle, shaft, or roller |
573 | Gear, threaded article, drill or serrated work surface (e.g., saw blade, etc.) |
574 | And cooling with fluid contact |
576 | Wire or filament |
577 | Chilling to subambient temperature |
579 | Iron(Fe) or iron base alloy |
580 | Spring or spring material |
581 | Railway stock (e.g., rails, wheels, axles, etc.) |
582 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
583 | Wheel |
584 | With working |
585 | With work handling |
586 | Gear |
587 | Threaded article (e.g., screws, drill bits, etc.) |
588 | Serrated work surface (e.g., saw blades, etc.) |
589 | Ring |
590 | Pipe or tube |
591 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
592 | Nine percent or more chromium(Cr) (e.g., stainless steel, etc.) |
593 | With working |
594 | With work handling |
595 | Wire, rod, or filament |
596 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
597 | Nine percent or more chromium(Cr) (e.g., stainless steel, etc.) |
598 | With working |
600 | With work handling |
601 | With coiling or treating of coiled strip |
604 | Of stacked plural workpieces |
605 | Nine percent or more chromium(Cr) (e.g., Stainless steel, etc.) |
606 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
607 | Ageing, solution treating (i.e., for hardening), precipitation strengthening or precipitation hardening |
609 | With working |
611 | Austenitic phase structure |
612 | Starting material contains 1.7 percent or more carbon (e.g., cast iron, etc.) |
613 | Decarburizing |
614 | Starting material is spherulitic (i.e., spheroidal) or vermicular (i.e., wormlike) |
615 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
616 | Treating or producing white or malleable cast iron |
619 | Containing 10 percent or more manganese(Mn) (e.g., Hadfield steel, etc.) |
621 | Highly alloyed (i.e., greater than 10 percent alloying elements) |
622 | Ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening |
625 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
626 | With preserving, recovering, separately treating or handling of the specified treating agent |
627 | With localized or zone heating or cooling |
628 | Using vacuum |
629 | Decarburizing or denitriding |
630 | Utilizing particulate fluid bed |
631 | Fused treating agent |
633 | Gaseous agent |
636 | Liquid agent |
639 | Localized or zone heating or cooling |
640 | Utilizing protective or insulating shielding from heat |
641 | Simultaneous heating and cooling treatment |
642 | Heating with flame treatment |
643 | With working |
644 | Cooling |
645 | With flattening, straightening, or tensioning by external force |
646 | With restraining of metal from expanding or contracting during heating or cooling |
648 | With working |
649 | Forging |
650 | With working at or below 120`C or unspecified cold working |
653 | With additional nonworking heating step |
654 | Including cooling (e.g., quenching, etc.) |
655 | With separate handling or treating of air, water, or unspecified fluid treating media |
656 | Work handling |
659 | Including spheroidizing |
660 | Including cooling (e.g., quenching, etc.) |
665 | Beryllium(Be) or beryllium base alloy |
666 | Magnesium(Mg) or magnesium base alloy |
668 | Refractory metal (i.e., titanium(Ti), zirconium(Zr), hafnium(Hf), vanadium(V), niobium(Nb), columbium(Cb), tantalum(Ta), chromium(Cr), molybdenum(Mo), tungsten(W)), or alloy base thereof |
669 | Titanium(Ti) or titanium base alloy |
672 | Zirconium(Zr) or zirconium base alloy |
673 | Tungsten(W) or tungsten base alloy |
674 | Cobalt(Co) or cobalt base alloy |
675 | Nickel(Ni) or nickel base alloy |
678 | Noble metals (i.e., silver(Ag), gold(Au), osmium(Os), iridium(Ir), platinum(Pt), ruthenium(Ru), rhodium(Rh), palladium(Pd)) or alloy base thereof |
679 | Copper(Cu) or copper base alloy |
680 | With working above 400`C or nonspecified hot working |
681 | Multiple working steps |
683 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening |
684 | With working |
686 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening |
687 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent or denitriding agent, etc.) or vacuum |
688 | Aluminum(Al) or aluminum base alloy |
689 | With extruding or drawing |
691 | With working above 400`C or nonspecified hot working |
692 | Multiple working steps |
694 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening |
695 | With working |
698 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening |
703 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
705 | Zinc(Zn) or zinc base alloy |
706 | Lead(Pb) or lead base alloy |
707 | Over 50 percent metal, but no base |
708 | Treating with specified agent (e.g., heat exchange agent, protective agent, decarburizing agent, denitriding agent, etc.) or vacuum |
709 | With preserving, recovering or separately handling or treating of the agent |
710 | Utilizing particulate form in fluid bed |
711 | In fused state |
712 | In gaseous state |
713 | In liquid state |
714 | Localized or zone heating or cooling treatment |
22 | COMPOSITIONS |
33 | BARRIER LAYER STOCK MATERIAL, P-N TYPE |
33.1 | With contiguous layer doped to degeneracy |
33.2 | With recess, void, dislocation, grain boundaries or channel openings |
33.3 | With non-semiconductive coating thereon |
33.4 | With contiguous layers of different semiconductive material |
33.5 | Having at least three contiguous layers of semiconductive material |
400 | STOCK |
401 | Radioactive |
300 | Magnetic |
301 | Rare earth and transition metal containing |
304 | Amorphous |
306 | Iron base (i.e., ferrous) |
312 | Nickel base |
313 | Cobalt base |
314 | Manganese base |
315 | No single metal over 50 percent |
316 | Carburized or nitrided |
402 | Mechanical memory |
403 | Amorphous, i.e., glassy |
404 | Directionally solidified |
320 | Ferrous (i.e., iron base) |
321 | 1.7 percent or more carbon containing (e.g., cast iron) |
322 | Malleabilized |
323 | Chill cast |
324 | Six percent or more group IV, V or VI transition metal containing |
325 | Nine percent or more chromium containing |
326 | Age or precipitation hardened or strengthened |
327 | Eight percent or more total content of nickel and/or manganese containing |
328 | Age or precipitation hardened or strengthed |
329 | Eight percent or more manganese containing |
330 | Beryllium or boron containing |
331 | Rare earth meal containing |
332 | Copper containing |
333 | Chromium containing, but less than 9 percent |
336 | Nickel containing |
337 | Three percent or more manganese containing or containing other transition metal in any amount |
405 | Age or precipitation hardened or strengthened |
406 | Magnesium base |
407 | Refractory metal base |
408 | Cobalt base |
409 | Nickel base |
411 | Copper base |
415 | Aluminum base |
419 | Containing over 50 percent metal, but no base metal |
420 | Magnesium base |
421 | Titanium, zirconium, or hafnium base |
422 | Vanadium, niobum, or tantalum base |
423 | Chromium, molybdenum, or tungsten base |
424 | Manganese base |
425 | Cobalt base |
426 | Nickel base |
430 | Noble metal base |
432 | Copper base |
437 | Aluminum base |
441 | Zinc base |
442 | Containing over 50 per cent metal, but no base metal |
CROSS-REFERENCE ART COLLECTIONS | ||
900 | ION IMPLANTED |
901 | SURFACE DEPLETED IN AN ALLOY COMPONENT (E.G., DECARBURIZED) |
902 | HAVING PORTIONS OF DIFFERING METALLURGICAL PROPERTIES OR CHARACTERISTICS |
903 | Directly treated with high energy electromagnetic waves or particles (e.g., laser, electron beam) |
904 | Crankshaft |
905 | Cutting tool |
906 | Roller bearing element |
907 | Threaded or headed fastener |
908 | Spring |
909 | Tube |
910 | In pattern discontinuous in two dimensions (e.g., checkerboard pattern) |
FOREIGN ART COLLECTIONS | ||
FOR000 | CLASS-RELATED FOREIGN DOCUMENTS |
DIGESTS | ||
DIG1 | AMORPHOUS SEMICONDUCTOR |
DIG2 | AMPHOTERIC DOPING |
DIG3 | ANNEAL |
DIG4 | ANNEALING, INCOHERENT LIGHT |
DIG5 | ANTIMONIDES OF GALLIUM OR INDIUM |
DIG6 | APPARATUS |
DIG7 | AUTODOPING |
DIG8 | BI-LEVEL FABRICATION |
DIG9 | BI-MOS |
DIG10 | BIPOLAR TRANSISTORS-ION IMPLANTATION |
DIG11 | BIPOLAR TRANSISTORS |
DIG12 | BONDING E.G., ELECTROSTATIC FOR STRAIN GAUGES |
DIG13 | BREAKDOWN VOLTAGE |
DIG14 | CAPACITOR |
DIG15 | CAPPING LAYER |
DIG16 | CATALYST |
DIG17 | CLEAN SURFACES |
DIG18 | COMPENSATION DOPING |
DIG19 | CONTACTS OF SILICIDES |
DIG20 | CONTACTS, SPECIAL |
DIG21 | CONTINUOUS PROCESS |
DIG22 | CONTROLLED ATMOSPHERE |
DIG23 | DEEP LEVEL DOPANTS |
DIG24 | DEFECT CONTROL-GETTERING AND ANNEALING |
DIG25 | DEPOSITION MULTI-STEP |
DIG26 | DEPOSITION THRU HOLE IN MASK |
DIG27 | DICHLOROSILANE |
DIG28 | DICING |
DIG29 | DIFFERENTIAL CRYSTAL GROWTH RATES |
DIG30 | DIFFUSION |
DIG31 | DIFFUSION AT AN EDGE |
DIG32 | DIFFUSION LENGTH |
DIG33 | DIFFUSION OF ALUMINUM |
DIG34 | DIFFUSION OF BORON OR SILICON |
DIG35 | DIFFUSION THRU A LAYER |
DIG36 | DIFFUSION, NONSELECTIVE |
DIG37 | DIFFUSION-DEPOSITION |
DIG38 | DIFFUSIONS-STAGED |
DIG39 | DISPLACE P-N JUNCTION |
DIG40 | DOPANTS, SPECIAL |
DIG41 | DOPING CONTROL IN CRYSTAL GROWTH |
DIG42 | DOPING, GRADED, FOR TAPERED ETCHING |
DIG43 | DUAL DIELECTRIC |
DIG44 | EDGE DIFFUSION UNDER MASK |
DIG45 | ELECTRIC FIELD |
DIG46 | ELECTRON BEAM TREATMENT OF DEVICES |
DIG47 | EMITTER DIP |
DIG48 | ENERGY BEAM ASSISTED EPI GROWTH |
DIG49 | EQUIVALENCE AND OPTIONS |
DIG50 | ETCH AND REFILL |
DIG51 | ETCHING |
DIG52 | FACE TO FACE DEPOSITION |
DIG53 | FIELD EFFECT TRANSISTORS FETS |
DIG54 | FLAT SHEETS-SUBSTRATES |
DIG55 | FUSE |
DIG56 | GALLIUM ARSENIDE |
DIG57 | GAS FLOW CONTROL |
DIG58 | GE GERMANIUM |
DIG59 | GERMANIUM ON SILICON OR GE-SI ON III-V |
DIG60 | GETTERING |
DIG61 | GETTERING-ARMORPHOUS LAYERS |
DIG62 | GOLD DIFFUSION |
DIG63 | GP II-IV-VI COMPOUNDS |
DIG64 | GP II-VI COMPOUNDS |
DIG65 | GP III-V (GENERIC) COMPOUNDS-PROCESSING |
DIG66 | GP III-V LIQUID PHASE EPITAXY |
DIG67 | GRADED ENERGY GAP |
DIG68 | GRAPHITE MASKING |
DIG69 | GREEN SHEETS |
DIG70 | GUARD RINGS AND CMOS |
DIG71 | HEATING, SELECTIVE |
DIG72 | HETEROJUNCTIONS |
DIG73 | HOLLOW BODY |
DIG74 | HORIZONTAL MELT SOLIDIFICATION |
DIG75 | IMIDE RESISTS |
DIG76 | IMPLANT |
DIG77 | IMPLANTATION OF SILICON ON SAPPHIRE |
DIG78 | IMPURITY REDISTRIBUTION BY OXIDATION |
DIG79 | INERT CARRIER GAS |
DIG80 | INFRA-RED |
DIG81 | INSULATORS |
DIG82 | ION IMPLANTATION FETS/COMS |
DIG83 | ION IMPLANTATION, GENERAL |
DIG84 | ION IMPLANTATION OF COMPOUND DEVICES |
DIG85 | ISOLATED-INTEGRATED |
DIG86 | ISOLATED ZONES |
DIG87 | I2L INTEGRATED INJECTION LOGIC |
DIG88 | J-FET (JUNCTION FIELD EFFECT TRANSISTOR) |
DIG89 | JOSEPHSON DEVICES |
DIG90 | LASER ANNEAL |
DIG91 | LASER BEAM PROCESSING OF FETS |
DIG92 | LASER BEAM PROCESSING-DIODES OR TRANSISTOR |
DIG93 | LASER BEAM TREATMENT IN GENERAL |
DIG94 | LASER BEAM TREATMENT OF COMPOUND DEVICES |
DIG95 | LASER DEVICES |
DIG96 | LATERAL TRANSISTOR |
DIG97 | LATTICE STRAIN AND DEFECTS |
DIG98 | LAYER CONVERSION |
DIG99 | LED, MULTICOLOR |
DIG100 | LIFT-OFF MASKING |
DIG101 | LIQUID PHASE EPITAXY LPE |
DIG102 | MASK ALIGNMENT |
DIG103 | MASK, DUAL FUNCTION E.G., DIFFUSION AND OXIDATION |
DIG104 | MASK, MOVABLE |
DIG105 | MASKS, METAL |
DIG106 | MASKS, SPECIAL |
DIG107 | MELT |
DIG108 | MELT BACK |
DIG109 | MEMORY DEVICES |
DIG110 | METAL-ORGANIC CVD (RUEHRWEIN TYPE) |
DIG111 | NARROW MASKING |
DIG112 | NITRIDATION, DIRECT, OF SILICON |
DIG113 | NITRIDES OF BORON OR ALUMINUM OR GALLIUM |
DIG114 | NITRIDES OF SILICON |
DIG115 | ORIENTATION |
DIG116 | OXIDATION, DIFFERENTIAL |
DIG117 | OXIDATION, SELECTIVE |
DIG118 | OXIDE FILMS |
DIG119 | PHOSPHIDES OF GALLIUM OR INDIUM |
DIG120 | PHOTOCATHODES-CS COATED AND SOLAR CELL |
DIG121 | PLASTIC TEMPERATURE |
DIG122 | POLYCRYSTALLINE |
DIG123 | POLYCRYSTALLINE DIFFUSE ANNEAL |
DIG124 | POLYCRYSTALLINE EMITTER |
DIG125 | POLYCRYSTALLINE PASSIVATION |
DIG126 | POWER FETS |
DIG127 | PROCESS INDUCED DEFECTS |
DIG128 | PROTON BOMBARDMENT OF SILICON |
DIG129 | PULSE DOPING |
DIG130 | PURIFICATION |
DIG131 | REACTIVE ION ETCHING RIE |
DIG132 | RECOIL IMPLANTATION |
DIG133 | REFLOW OXIDES AND GLASSES |
DIG134 | REMELT |
DIG135 | REMOVAL OF SUBSTRATE |
DIG136 | RESISTORS |
DIG137 | RESISTS |
DIG138 | ROUGHENED SURFACE |
DIG139 | SCHOTTKY BARRIER |
DIG140 | SCHOTTKY BARRIER CONTACTS |
DIG141 | SELF-ALIGNMENT COAT GATE |
DIG142 | SEMICONDUCTOR-METAL-SEMICONDUCTOR |
DIG143 | SHADOW MASKING |
DIG144 | SHALLOW DIFFUSION |
DIG145 | SHAPED JUNCTIONS |
DIG146 | SHEET RESISTANCE (DOPANT PARAMETERS) |
DIG147 | SILICIDES |
DIG148 | SILICON CARBIDE |
DIG149 | SILICON ON III-V |
DIG150 | SILICON ON SAPPHIRE SOS |
DIG151 | SIMULTANEOUS DIFFUSION |
DIG152 | SINGLE CRYSTAL ON AMORPHOUS SUBSTRATE |
DIG153 | SOLAR CELLS-IMPLANTATIONS-LASER BEAM |
DIG154 | SOLID PHASE EPITAXY |
DIG155 | SOLID SOLUBILITY |
DIG156 | SONOS |
DIG157 | SPECIAL DIFFUSION AND PROFILES |
DIG158 | SPUTTERING |
DIG159 | STRAIN GAUGES |
DIG160 | SUPERLATTICE |
DIG161 | TAPERED EDGES |
DIG162 | TESTING STEPS |
DIG163 | THICK-THIN OXIDES |
DIG164 | THREE DIMENSIONAL PROCESSING |
DIG165 | TRANSMUTATION DOPING |
DIG166 | TRAVELING SOLVENT METHOD |
DIG167 | TWO DIFFUSIONS IN ONE HOLE |
DIG168 | V-GROOVES |
DIG169 | VACUUM DEPOSITION (INCLUDES MOLECULAR BEAM EPITAXY |
DIG170 | VAPOR-LIQUID-SOLID |
DIG171 | VARISTOR |
DIG172 | VIDICONS |
DIG173 | WASHED EMITTER |
DIG174 | ZENER DIODES |
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