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Table of Contents
ACKNOWLEDGMENTS1.0 DESCRIPTION OF PROJECT
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1.1 Overview of DfE PWB Project
1.2 Purpose of the Survey
1.3 Survey Procedures
1.4 Overview of Results
3.0 PRODUCTION METHODS AND MATERIALS
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3.1 General
3.2 Overview of PWB Manufacturing Process
3.3 Specific PWB Production Steps
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3.3.1 Inner-Layer Etchants
3.3.2 Oxide
3.3.3 Clean Holes (Desmear)
3.3.4 Making Holes Conductive (or Through-Hole Metalizing)
3.3.5 Outer-Layer Etch Resist
3.3.6 Outer Layer Etchant
3.3.7 Solder Masks
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4.1 General
4.2 Discharge Types
4.3 Discharge Flow Rates
4.4 Discharge Limits and Compliance Difficulties
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5.1 General
5.2 Good Operating Procedures
5.3 Drag-out Reduction and Recovery Methods
5.4 Rinse Water Use Reduction
7.0 OFF-SITE RECYCLING
8.0 END-OF-PIPE TREATMENT
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8.1 General
8.2 Wastewater Characterization
8.3 Types of Processes/Systems Employed
8.4 End-of-Pipe Treatment Capital Costs
8.5 End-of-Pipe Treatment Operation Costs
8.6 Sludge Generation and Disposal
8.7 Air Pollution Control
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9.1 General
9.2 Environmental and Occupational Health Challenges
9.3 Information Needs
9.4 Source of Technical Information
APPENDIX A (SURVEY FORM) APPENDIX B (PROCESS CHEMICAL DATA)
LIST OF EXHIBITS
Exhibit 2-1. Facility Characterization DataExhibit 2-2. Product Type and Technology Level Data
Exhibit 2-3. Distribution of Respondents by Technology Level
Exhibit 2-4. Distribution of Respondents by Board Type
Exhibit 2-5. Base Materials Used for Rigid PWB Manufacture
Exhibit 2-6. Process Capabilities of Respondents
Exhibit 3-1. Overview of Rigid PWB Manufacturing Process Sequences
Exhibit 3-2. Inner-Layer and Outer-Layer Etchants Used by Survey Respondents
Exhibit 3-3. Distribution of Inner and Outer Layer Etchant Use Types Employed by Survey Respondents
Exhibit 3-4. Inner-Layer Copper Surface Preparation Data
Exhibit 3-5. Etchback and Desmear Methods Data
Exhibit 3-6. Distribution of Etchback and Desmear Methods Employed by Survey Respondents
Exhibit 3-7. Through-Hole Metalizing Methods Data
Exhibit 3-8. Distribution of Through-Hole Metalizing Methods Employed by Survey Respondents
Exhibit 3-9. Outer-Layer Etch Resists Data
Exhibit 3-10. Distribution of Outer Layer Etch Resists Methods Employed by Survey Respondents
Exhibit 3-11. Solder Mask Data
Exhibit 4-1. Water Use and Wastewater Discharge Information
Exhibit 4-2. Discharge Limitations and Compliance Difficulties
Exhibit 5-1. Good Operating Procedures Employed by Survey Respondents
Exhibit 5-2. Drag-Out Reduction and Recovery Methods Data
Exhibit 5-3. Distribution of Drag-Out Reduction and Recovery Methods
Exhibit 5-4. Rinse Water Use Reduction Methods Data
Exhibit 5-5. Distribution of Rinse Water Use Reduction Methods
Exhibit 5-6. Wastewater Discharge Reduction Achieved Through Pollution Prevention
Exhibit 6-1. Pollution Prevention Technology Data
Exhibit 7-1. Off-Site Recycling of Spent Process Fluids (continued on nest page)
Exhibit 7-2. Off-Site Recycling/Disposal of Wastewater Treatment Sludge
Exhibit 8-1. Wastewater Characterization Data
Exhibit 8-2. Wastewater Treatment Equipment Data
Exhibit 8-3. Wastewater Treatment Operating Costs
Exhibit 8-4. Wastewater Treatment Operating Costs as a Percentage of Sales Volume
Exhibit 8-5. Air Pollution Control Devices
Exhibit 9-1. PWB Industry Environmental and Occupational Health Challenges
Exhibit 9-2. PWB Industry Information Needs
Exhibit 9-3. PWB Industry Sources of Technical Information
Exhibit 9-4. Desired Media for Presentation of Survey Results