September 8-10, 2009
Shanghai, China
The 5th annual MEDTEC CHINA Exhibition and Conference is a part of the international series of medical device technology exhibitions and conferences produced by US based Canon Communications. The company has since 1978 been the world’s leading information provider to the global medical device manufacturing industry. Engineers and management from medical device manufacturers based in Europe, the US and Japan now enjoy the ability to attend MEDTEC on an annual basis to view, learn and meet new suppliers and old, as well as to attend its wide range of technical, process and regulatory conferences.
MEDTEC China, organized Canon Communications LLC, is an exclusive
industry event dedicated to the Chinese medical manufacturing
marketplace. 90% of the show exhibitors are from the United
States and Europe. MEDTEC China Shanghai is expected to attract
over 5,000 senior decision-makers and medical manufacturing
professionals. The show will be held at INTEX SHANGHAI, September
8-10, 2009.
China's medical device market is growing at an annual pace of
15%—nearly double the rate of the industry worldwide. With a
booming economy and a rapidly expanding middle class, the demand
for technologically sophisticated medical devices, equipment and
systems is expected to soar—well into the foreseeable future.
China's well-established medical manufacturing industry produces
45-50% of current market needs. Imports of finished medical
products have traditionally made up the balance.
For U.S. suppliers of medical grade materials, components,
electronics, advanced product design, assembly, and manufacturing
technologies, China is open for business and ready to integrate
your products and technological know-how into the design and
manufacture of the complete range of medical devices,
instruments, equipment and systems for every application and
healthcare specialty. Please join the U.S. pavilion at MEDTECH
China in Shanghai to take advantage of this opportunity.
For more information, visit www.medtecchina.com
or contact Lisa Huot (lisa.huot@mail.doc.gov )