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Publications Details for:

Microstructural, Morphological and Electrical Studies of a Unique Dry Plasma Metal Deposition for Printed Circuit Boards (PCBs)
Grant Number R826119
RFA: Technology for a Sustainable Environment (1997)

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  • Presentation (7)
    • Reference Type Citation Progress Report Year Document Sources
    Presentation Continuous air to vacuum to air (AVA) manufacturing processes. Presented at the NSF Grantees Conference, 1999, and published by Society of Manufacturing Engineers. R826119 (1999)
    		 not available
    Presentation Barth KL, Enzenroth RA, Sampath WS. Continuous air to vacuum to air (AVA) manufacturing processes. Presented at the NSF Grantees Conference, 1999, and published by Society of Manufacturing Engineers. R826119 (Final)
    		 not available
    Presentation Continuous belt air to vacuum to air (AVA) processing of thin films and devices. Presented at the NSF Grantees Conference, 2000, and to be published by the Society of Manufacturing Engineers. R826119 (1999)
    		 not available
    Presentation Barth KL, Enzenroth RA, Sampath WS. Continuous belt air to vacuum to air (AVA) processing of thin films and devices. Presented at the NSF Grantees Conference, 2000, and to be published by the Society of Manufacturing Engineers. R826119 (Final)
    		 not available
    Presentation Barth KL, Enzenroth RA, Sampath WS. Further advances in continuous belt air to vacuum to air (AVA) processing and recycling. Presented at the NSF Grantees Conference and published by the Society of Manufacturing Engineers, 2002. R826119 (Final)
    		 not available
    Presentation Barth KL, Enzenroth RA, Sampath WS. Further advances in continuous belt air to vacuum to air (AVA) processing. Presented at the NSF Grantees Conference and published by the Society of Manufacturing Engineers, 2001. R826119 (Final)
    		 not available
    Presentation Sampath WS, Barth KL, Enzenroth RA, Hebert P. Progress in air to vacuum to air (AVA) deposition of thin films, printed circuit boards (PCBs) and solar cells. Presented at the NSF Grantees Conference, 1998, published by Society of Manufacturing Engineers. R826119 (1999)
    R826119 (Final)
    		 not available

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