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Journal Publications Details for:

Fundamental Understanding and Performance Enhancement of Conductive Adhesive for Microelectronic Packaging Applications
Grant Number R831489
RFA: Technology for a Sustainable Environment (2003)

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  • Journal Article (30)
    • Reference Type Citation Progress Report Year Document Sources
    Journal Article Dong H, Moon KS, Wong CP. Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate. Journal of Electronic Materials 2004;33(11):1326-1330 R831489 (2004)
    		 not available
    Journal Article Dong H, Zhang ZQ, Wong CP. Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications. Journal of Adhesion Science and Technology 2005;19(2):87-94 R831489 (2004)
    R831489 (2005)
    		 not available
    Journal Article Dong H, Moon KS, Wong CP. Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications. Journal of Electronic Materials 2005;34(1):40-45 R831489 (2004)
    R831489 (2005)
    		 not available
    Journal Article Dong H, Meininger A, Jiang H, Moon K-S, Wong CP. Magnetic nanocomposite for potential ultrahigh frequency microelectronic application. Journal of Electronic Materials 2007;36(5):593-597. R831489 (2007)
  • Abstract: Springer
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    • Journal Article Dong H, Li Y, Yim MJ, Moon KS, Wong CP. Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules. Applied Physics Letters 2007;90(9):092102, 3 pp. R831489 (2006)
    R831489 (2007)
  • Abstract: Applied Physics Letters Abstract
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    • Journal Article Jiang HJ, Moon KS, Lu J, Wong CP. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization. Journal of Electronic Materials 2005;34(11):1432-1439. R831489 (2005)
    		 not available
    Journal Article Jiang H, Moon K, Li Y, Wong CP. Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chemistry of Materials 2006;18(13):2969-2973. R831489 (2006)
  • Abstract: ACS Abstract
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    • Journal Article Jiang HJ, Moon KS, Zhang ZQ, Pothukuchi S, Wong CP. Variable frequency microwave synthesis of silver nanoparticles. Journal of Nanoparticle Research 2006;8(1):117-124 R831489 (2004)
    R831489 (2005)
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    Journal Article Jiang H, Moon K, Hua F, Wong CP. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chemistry of Materials 2007;19(18):4482-4485. R831489 (2007)
  • Abstract: ACS
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    • Journal Article Jiang H, Zhu L, Moon K-S, Wong CP. The preparation of stable metal nanoparticles on carbon nanotubes whose surface were modified during production. Carbon 2007;45(3):655-661. R831489 (2007)
  • Abstract: Science Direct
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    • Journal Article Jiang H, Moon K-S, Sun Y, Wong CP, Hua F, Pal T, Pal A. Tin/indium nanobundle formation from aggregation or growth of nanoparticles. Journal of Naonoparticle Research 2008;10(1):41-46. R831489 (Final)
  • Full-text: SpringerLink
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  • Abstract: SpringerLink
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  • Other: SpringerLink PDF
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    • Journal Article Li Y, Moon KS, Wong CP. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials 2005;34(3):266-271. R831489 (2005)
    		 not available
    Journal Article Li Y, Moon KS, Wong CP. Materials science. Electronics without lead. Science 2005;308(5727):1419-1420. R831489 (2005)
    		 not available
    Journal Article Li Y, Moon KS, Wong CP. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties. Journal of Electronic Materials 2005;34(12):1573-1578. R831489 (2005)
    		 not available
    Journal Article Li Y, Xiao F, Moon KS, Wong CP. Novel curing agent for lead-free electronics: amino acid. Journal of Polymer Science Part A: Polymer Chemistry 2005;44(2):1020-1027. R831489 (2005)
    R831489 (2006)
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    Journal Article Li Y, Moon KS, Wong CP. Reliability improvement of conductive adhesives on tin (Sn) surfaces. Journal of Adhesion Science and Technology 2005;19(16):1427-1444. R831489 (2005)
    		 not available
    Journal Article Li Y, Moon KS, Wong CP. Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids. IEEE Transactions on Components and Packaging Technologies 2006;29(1):173-178. R831489 (2005)
    R831489 (2006)
  • Abstract: IEEE Xplore
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    • Journal Article Li Y, Moon KS, Wong CP. Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering. Journal of Applied Polymer Science 2006;99(4):1665-1673. R831489 (2005)
    R831489 (2006)
  • Abstract: InterScience
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    • Journal Article Li Y, Moon KS, Whitman A, Wong CP. Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes. IEEE Transactions on Components and Packaging Technologies 2006;29(4):758-763. R831489 (2006)
  • Abstract: IEEE Xplore
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    • Journal Article Li Y, Wong CP. High performance anisotropic conductive adhesives for lead-free interconnects. Soldering & Surface Mount Technology 2006;18(2)33-39. R831489 (2006)
  • Abstract: Emerald Insight Abstract
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    • Journal Article Li Y, Wong CP. Monolayer protection for eletrochemical migration control in silver nanocomposite. Applied Physics Letters 2006;89(11):112112, 3 pp. R831489 (2006)
  • Abstract: Applied Physics Letters Abstract
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    • Journal Article Li Y, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering R: Reports 2006;51(1-3):1-35. R831489 (2005)
    R831489 (2006)
  • Abstract: Science Direct Abstract
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    • Journal Article Li Y, Yim MJ, Wong CP. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials 2007;36(5):549-554. R831489 (2007)
  • Abstract: Springer
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    • Journal Article Li Y, Xiao F, Wong CP. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy. Journal of Polymer Science Part A: Polymer Chemistry 2007;45(2):181-190. R831489 (2006)
    R831489 (2007)
  • Abstract: InterScience Abstract
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    • Journal Article Li Y, Yim MJ, Moon KS, Wong CP. Novel nano-scale conductive films with enhanced electrical performance and reliability for high performance fine pitch interconnect. IEEE Transactions on Advanced Packaging 2009;32(1):123-129. R831489 (Final)
  • Abstract: IEEE Xplore
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    • Journal Article Moon KS, Dong H, Maric R, Pothukuchi S, Hunt A, Li Y, Wong CP. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. Journal of Electronic Materials 2005;34(2):168-175. R831489 (2005)
    		 not available
    Journal Article Moon KS, Li Y, Xu JW, Wong CP. Lead-free interconnect technique by using variable frequency microwave. Journal of Electronic Materials 2005;34(7):1081-1088 R831489 (2004)
    R831489 (2005)
    		 not available
    Journal Article Yim MJ, Li Y, Moon KS, Wong CP. Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives. Journal of Electronic Materials 2007;36(10):1341-1347. R831489 (2007)
  • Full-text: Springer pdf
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  • Abstract: Springer
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    • Journal Article Yim MJ, Li Y, Moon K-S, Paik KW, Wong CP. Review of recent advances in electrically conductive adhesive materials and technologies in electronic packaging. Journal of Adhesion Science and Technology 2008;22(14):1593-1630. R831489 (Final)
  • Abstract: Journal of Adhesion Science and Technology
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    • Journal Article Chiang HW, Chung C-L, Chen LC, Li Y, Wong CP, Fu SL. Processing and shape effects on silver paste electrically conductive adhesives (ECAs). Journal of Adhesion Science and Technology 2005;19(7):565-578. R831489 (2005)
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