PACK EXPO International 2008 will focus on the latest developments in packaging technology and will showcase exhibitors’ state-of-the-art advancements in packaging machinery, converting machinery, processing technology, materials, packages, containers and components. PACK EXPO International is held biennially on the odd numbered years – ideal timing for new product technology introductions. Exhibitors will bring their top technicians and engineers to provide onsite packaging solutions to even the toughest packaging challenges. Co-located with PROCESS EXPO, Converting & Package Printing (CCP) EXPO, PACK EXPO International is one of the world’s leading and most comprehensive packaging events created to meet the needs of everyone in the industry.

Visit www.packexpo.com or www.fpsa.com for more information on the upcoming show.

Pre-Register through the form below: