Security Enhanced Linux
What's New
Frequently Asked Questions
Background
Documents
License
Download
Participating
Mail List
Archives
Remaining Work
Contributors
Related Work
Press Releases
Information Assurance Research
NIARL In-house Research Areas
Mathematical Sciences Program
Sabbaticals
Computer & Information Sciences Research
Technology Transfer
Advanced Computing
Advanced Mathematics
Communications & Networking
Information Processing
Microelectronics
Other Technologies
Technology Fact Sheets
Publications
Related Links
|
Method of Fabricating and Integrating High-Quality Decoupling CapacitorsAliases:NoneTechnical Challenge:Provide sufficient decoupling capacitance physically close to the processor.Description:This method can be used to build decoupling capacitors with high capacitance values, low parasitic losses, good yield, and long-term reliability. The fabrication method can also manufacture other passives such as inductors and resistors; as well as interconnect lines. The invention enables high yielding capacitors and other passive elements to be placed very close to the processor or other integrated circuit design and provides improved signal integrity for high frequency processing. Additionally, it allows multiple passive components to be integrated into a single module, reducing cost and increasing yields for RF systems.Demonstration Capability:None available at this timePotential Commercial Application(s):Supercomputing applications, high-speed processor systems, hand held electronics (cell phones, pagers, etc.)Patent Status:Patent Application has been filed with USPTO. (Updated)Reference Number: 1352If you are interested in exploring this technology further, please call 443-445-7159 or express your interest in writing to the: National Security Agency |
|
Date Posted: Jan 15, 2009 | Last Modified: Jan 15, 2009 | Last Reviewed: Jan 15 2009 |