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Ames
Research Center
1988 Phase II
Gallium Arsenide
Semiconductor Chips
Top-Vu
Technology, Inc.
St. Paul, MN
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INNOVATION
Development of gallium arsenide (GaAs)
semiconductor chips to operate with less noise and lower temperatures
than silicon chips
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Chip layout of a 256x256 infrared
sensor readout and preprocessing
electronics, implemented in Triquint
GaAs MESFET QED/A process
(9 mm x 10.5 mm, 12 mW).
Optional Powerpoint
file
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ACCOMPLISHMENTS
- The company has set up a chip
design service to design, layout and test of analog and digital
integrated circuits using any semiconductor technologies including
Si, GaAs and InP
- Our paper presented at GOMAC
'98 titled "GaAs-Based Microsensor Systems" has been selected as
the Outstanding Paper. The microsensor systems include microsensors,
readout electronics, analog to digital converters and digital signal
processors
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COMMERCIALIZATION
- GaAs readout electronics for
astronomical applications
- GaAs based microsensor systems
- NASA Ames SBIR Phase 1and Phase
2 contracts were first contracts awarded to Top-Vu
- On the basis of the GaAs contracts,
Top-Vu was able to grow from two employees to nine
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GOVERNMENT/SCIENCE
APPLICATIONS
- Many GaAs applications for NASA,
U.S. Army, USAF, and NationalScience Foundation, with sales
to government agencies totaling $2.2M
- Typical applications include
GaAs chips incorporated into cryogenic devices, sensors, readout
multiplexers, accelerometers for guidance and navigation, and infrared
microsensors
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| For more
information about this firm, please send e-mail to company
representative
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Curator:
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