Licensable Technologies : Security & Defense

Method of Transferring an Ultra-Thin Layer of Crystalline Silicon with High Crystalline Quality

Abstract
With the acceleration of new technology nodes and the resulting industry shift to advanced materials that provide enhanced device performance and low power consumption, silicon-on-insulator (SOI) wafer technology has become a critical, enabling technology. This invention provides a revolutionary method of transferring an ultra-thin layer of crystalline material with high crystalline quality.

Application(s)
• Silicon on insulator (SOI) wafers
• Embedded processors
• Semiconductors
• Integrated circuits
• Silicon-on-quartz
• Silicon-on-glass

Advantages
• Better control of layer thickness
• Improved quality of the thin layer
• Improved smoothness of the thin layer
• Less transfer defects

IP Status: Available both Exclusively and Non Exclusively

Commercialization Strategy: Available for non-exclusive and exclusive field of use license.

Reference Number: 660

S Number: DOE reference no.(s): 104,967

Patents & Applications:
United States National Patent Number 7153761 Issued on 12/26/2006

Posted: 03-01-2006

Contact
John Mott
Technology Transfer Division
Los Alamos National Laboratory
P.O. Box 1663, MailStop C334
(505) 665-0883
jmott@lanl.gov