NASA/GSFC has a requirement for the purchase of a microme|x sub-micron high-resolution automatic x-ray system for 2D- and 3D- inspection with the following minimum specifications:
System Magnification and Resolution
1. Geometric magnification up to 2,160 x
2. Total magnification up to 23,320 x without software zoom
3. Detail detect ability < 1 μm
Sub-micron X-ray tube
1. Type open tube, transmission head, 170° cone angle, collimated
2. Target tungsten on non-toxic support, rotatable for multiple use
3. Filament tungsten hairpin, pre-adjusted in plug-in cartridges for easy and fast exchange
4. Vacuum system turbo-molecular and oil-free roughing pump
5. Maximum tube voltage 180 kV
6. Maximum tube power 20 W
7. Dose rate stability < 0.5 % / 8 h
Detector
1. Digital image chain for enhanced and superior resolution: full digital imaging with: highly resolving 4" dual-field image intensifier, 2MPixel digital camera and 24" TFT display
Manipulator
1. General construction high-precision vibration-free synchronised 5-axes manipulation
2. Max. inspection area 460 mm x 360 mm (18" x 14"), 610 mm x 560 mm (24" x 22"), without rotation table
3. Maximum sample size / weight 680 mm x 635 mm (27" x 25") / 10 kg (22 lbs.)
4. ovhm – oblique view at highest steplessly adjustable view angle up to 70°, rotation 0° - 360° magnification
5. Control joystick control or mouse (manual mode) and CNC (automatic mode)
6. Axis speed (X-Y-Z) 10 micron/s to 80 mm/s
7. Manipulation aids sample X-ray mapping, click'n-move-to function, click'n-zoom-to function, automatic isocentric manipulator movement, laser crosshair
8. Anti-Collision System may be deactivated for maximum magnification (touching the sample)
Image processing (16 bit)
1. quality |assurance comprehensive X-ray inspection software comprising image enhancement
2. functions, measuring functions and CNC inspection programming for automatic inspection
3. bga|module (standard) for automatic BGA solder-joint evaluation incl. automatic wetting analysis
4. vc|module (standard) automatic voiding calculation software package incl. capability of multiple die attach void evaluation
System Dimensions
1. Dimensions (W x H x D) 2020 mm x 1920 mm x 1860 mm (79.5" x 75.6" x 73.2") (without console, including 300 mm (11,8") demountable back side extension)
2. Min. transportation width 1,560 mm (61.4")
3. Height adjustable control panel (D) 500 mm (19.5")
4. Weight appr. 2,300 kg / 5,070 lbs.
Radiation Safety
1. Safety Cabinet steel lined with lead, lead glass, leakage radiation < 1 μSv / h
Software Options
1. ml|module registration of multilayer printed circuit boards
2. qfp|module for automatic QFP solder joint evaluation incl. automatic wetting analysis
3. qfn|module for automatic inspection of QFN / MLF solder joints
4. pth|module for automatic pin-through-hole solder joint evaluation
5. c4|module evaluation of round solder joints with background structure, such as c4 bumps
6. quality|review visual interface for rework and failure indication
7. Xe2 X-ray image Evaluation Environment, toolbox of elementary algorithms to design individual image evaluation routines
8. cad|import import of CAD files for inspection programming
Hardware options
1. Tilt / rotate unit tilt ± 45° and rotation n x 360° for samples up to 2 kg
2. low-dose|mode beam-shutter for dose reduction and individual triggered exposure
3. Manual bar code reader for automatic product identification
CT capability (option)
1. Upgrade package for combined 2D / 3D (computed tomography) operation
2. CT-unit precision rotation axis
3. Volume acquisition / reconstruction 3D|arv software
4. Maximum geometric magnification (CT) 300 x
5. Max. voxel resolution down to 3 μm, depending on the sample size
6. Visualisation software Volume Viewer
7. Subject to change without further notice.
Training to NASA Engineers
NASA/GSFC intends to purchase the items from Phoenix X-Ray because the microme|x system is the only one that meets all requirements including the x-ray voltage (180kV minimum) detailed detectability (1um or less), image resolution (16 bit) image tilt (+/-45degrees), direct image magnification (2,000X minimum), and power requirement (115VAC 15A single phase).
The Government intends to acquire a commercial item using FAR Part 12.
DO Rating is DO-C9. The synopsis shall not be construed as a commitment by the Government, nor will the Government pay for the information solicited.
Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 p.m. eastern local time on July 25, 2008. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government.
Oral communications ARE NOT acceptable in response to this notice.
All contractual and technical questions must be submitted in writing via e-mail to Janicea.L.McCree@nasa.gov no later than July 20, 2008 or via facsimile at 301-286-9159.
All responsible sources may submit an offer which shall be considered by the agency.
An Ombudsman has been appointed. See NASA Specific Note "B".
Any referenced notes may be viewed at the following URLs linked below.
