The component test and evaluation laboratory provides electrical test capability and coordination of environmental stress for the evaluation of semiconductor and microelectronic devices. Testing can be performed over an ambient temperature range from –70°C to +200°C. In addition, wafer probe capability is available.

Electrical test capabilities include:

Teradyne A567 Advanced Mixed Signal test system configured to provide AC and DC characterization of a broad range of components including:

• Analog IC's
• Digital IC's
• Mixed signal IC's
• Synchronized power devices

Tesec Automated Test System provides both high and low power electrical stimulus for characterizing discrete semiconductor components including:

• Diodes (general purpose, zener, Schottky, etc.)
• Bipolar Junction Transistors
• Field Effect Transistors (MOSFET, JFET, Power MOSFET, etc.)
• Thyristors (SCRs, triacs, etc.)

SPICE Model Extraction system utilizes Agilent’s IC-CAPä software for equipment control and data acquisition for the extraction of SPICE parameters. Equipment includes:

• DC parametric analyzers
• AC Network analyzers
• Capacitance meters
• Specialized parameter characterization using a broad range of bench instrumentation along with software development for control and acquisition.

Environmental stress capabilities include:

Thermal

• Burn-in
• Life Test
• Highly Accelerated Stress Testing (HAST)
• Thermal Shock
• Temperature Cycling

Radiation

• Static Neutron
• Gamma total dose, for both normal and enhanced low dose rate conditions
• Gamma dose rate (photocurrent and latch-up)
• Single event

Mechanical

• Shock
• Vibration
• Acceleration