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| Georgia Tech >> College of Engineering >> ECE >> PRC | ||||||||||
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Membership and Partnership Programs
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Introduction to PRC (pdf)
Bylaws (pdf) Membership Agreement (pdf) |
The Microsystems Packaging Research Center (PRC), at the Manufacturing Research Center on the Georgia Tech campus, was established in 1994 as a U.S. National Science Foundation Engineering Research Center. The PRC is the largest academic center dedicated to System-On-Package (SOP) microsystems packaging technologies. This information outlines the PRC’s Membership and Partnership programs and their options, benefits, and costs. Participation with the PRC consists mainly of the following:
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PRC MEMBERS & AFFILIATIONS (Past & Present) Industry AMD • Agilent • Air Product & Chem. • Alcatel USA • Altera Corporation • AMAT • AMP/Tyco Int’l. • Analog Devices • Ansoft Corporation • Anvik • Applied Materials • Applied Simulation • Ardex • Asahi Glass • Asymtek • AT&S • AT&T • Atotech-Berlin • AVX Corporation • BAE Systems • Batelle-Pacific • BellSouth • Boeing • Bosch • Bourns • BPW • BTU • Cadence Design • Cascade Microtech • Chemfirst EKC • Chemical Products • Chrysler • Circuit Tech. • Cisco • Compaq Corp. • Contec • Cookson America • Cree • CYC Enterprises • Delco • Delphi Automotive • Dexter Research • Dickerson Vision • Dow Corning • Draper Laboratory • DuPont EKC Technology • Emerg. Tech. (ETS) • Emerson & Cumm • Endicott (EIT) • Engent • EPCOS • Ericcson • Flipchip Tech. • General Electric • Goodrich • Gould Electronics • Hadco • Halliburton Energy • Harima Chemicals • Harris Corporation • Hewlett Packard • Hitachi Chemical • Honeywell Int’l • Hughes Research • Ibiden • Indium Corporation • Industrial Logic Corp. • Infineon • Inframat Corporation • Inplane Photonics • Intel Corp. • IBM • Irvine Sensors • Jacket Micro Devices • JDS Uniphase • Johnson Matthey • Kimberly Clark • Kodak • KYMA • Kyocera • Lambda Electronics • Lambda Technologies • LG Electronics • Lockheed Martin • Loctite • Logic Vision • Lord Corporation • Lucent Technologies • Matsushita Electric • Micro Substrates • Micro-ASI • MicroCoating (MCT) • MicroModule Systems • Micron Technologies • Microsoft • Motorola • Nanonexus • National Semiconductor • National Starch • NCR • NEC-Japan • Nitronex • Nokia • Northrop-Grumman • NTK/NGK Sparkplug • NXP • Oak-Mitsui • Panasonic • Panda Project • Polaroid • Polymer Aging • Polymer Solutions • Power Delivery Net. • Pratt & Whitney • Promerus • QualComm • Quellan • Rambus • Raytheon • Research Devices • Rockwell Collins • Rogers • Rohm & Haas • R-Soft • Samsung Electronics • Samsung Techwin • Savantage Corp. • Schlumberger • Semco • Shipley • Siemens • SkyWorks • Sonoscan • Sony • Specialty Coating • SRC • Starfire Systems • Sun Microsystems • Tellabs • Tessera Technologies • Texas Instruments • Toray • TriQuint Semicon. • Visteon • VT Silicon • Xerox-PARC • Zenith Electronics
Government AFOSR • DARPA • DOE • EPA • Jet Propulsion Lab-CA • NASA • NAVY • NIH • NIST • NSA/DOD • NSF • Sandia National Labs • Sameer • Oak Ridge Nat. Labs • U.S. Army/AMCOM Standards Organizations IEEE • IMAPS • iNEMI • MARCO Academia Arizona State University • Auburn University • Budapest University • Calif. Inst. of Technology • Carnegie Mellon • Chalmers University • Clemson University • SUNY • Binghamton • Fraunhofer Univ. • IME-Sing. (A*Star) • Indian Institute • KETI • Polytechnic di Torino • Rutgers University • University of Arkansas • University of Denver • University of Illinois • University of Maryland • University of Michigan • University of Minn. • Univ. NY-Binghamton • Univ. of Texas-Austin • Univ. of Washington
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