![]() |
||||||||||
Georgia Tech >> College of Engineering >> ECE >> PRC | ||||||||||
Welcome | Academics | Students | Faculty & Staff | Research | Industry Partnerships | News Archive | ||||||||||
Thermal Interface Materials (TIM)
An Industry-Academia Consortium in Partnership with State University of New York - Binghamton
![]()
Leaders: Profs. Yogendra Joshi, ME (lead), C.P. Wong, Sam Graham, Rao Tummala, Suresh Sitaraman, Jianmin Qu, Dr. Raj Pulugurtha (Georgia Tech); Bahgat Sammakia (SUNY-Binghamton)
Goal: 10X Improvement in RTIMLaunched: September 1, 2007 | Next Meeting Information & Online Registration
Contact: Prof. Yogendra Joshi, yogendra.joshi@me.gatech.edu, 404-385-2810
Proposed Projects
- Development of Aligned Carbon Nanotube Films For Thermal Interface Material Applications
- Assembly and Testbed Research with Metal and Metal Composite TIM
- Thermal and Thermomechanical Modeling and Characterization of TIMs and Their Interfaces
- Design for Reliability of Thermal Interface Materials
Participating Companies (Signed up or in signing stage - Last Update September 10, 2008)
- Bosch
- Celestica
- Chomerics
- Dow Corning
- Honeywell
- Hynix
- Lord Corporation
- Maxtek
- Rohm and Haas