Microsystems Packaging Research Center

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UPCOMING EVENTS

3DASSM Consortium Launch planned for Jan. 2009.
Companies currently investigating 3DASSM:

Visitor Travel Info

RECENT EVENTS

3D All Silicon System Module (3DASSM) Consortia Workshop held Oct. 28-29, 2008

ECE Highlights Article on PRC Industry Week

PUBLICATIONS

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Books

First textbook on SOP: "Introduction to System -on-Package (SOP)" to be published May '08.

Power Integrity Modeling Book by Prof. Madhavan Swaminathan and Dr. Ege Engin

"Fundamentals of Microsystems Packaging" - McGraw-Hill: First textbook on the entitled subject.
NOTE: Professors using "Fundamentals of Microsystems Packaging" can order the companion Homework Solutions CD.

Articles

The 3DASSM Consortium: An Industry/Academia Collaboration - Advanced Packaging, March 2008

Moving Next-Generation Electronics beyond Moore’s Law - by Prof. Rao Tummala, GT's Research Horizons.

“Moore’s Law Meets Its Match" by Prof. Rao Tummala, June '06 IEEE Spectrum.

RESEARCH

Mixed Signal Design & Tools

Embedded Actives & Passives

Next Generation Thermal Interface Materials

3D All Silicon System Module

EDUCATION

Courses

ECE 4460 (pdf) - Introduction to Electronic Systems Packaging

ECE/ChBE/MSE 4755 (pdf) - Design-Build-Operate (DBO1) Electronics Packaging Substrate Fabrication

ECE/ME/MSE 6776 (pdf) - Introduction to SOP, SIP, 3D and SOC - An Interdisciplinary Perspective

ECE 8803 (pdf) - Special Topics Course Power Integrity Modeling and Design

STUDENTS

PRC Student Council

Full-time Jobs & Internships

Awards

NEW PEOPLE AT PRC

Ritwik Chatterjee - Associate Director, Silicon Systems Research

Nitesh Kumbhat - Research Engineer

Pradeep Dixit - Post Doctoral Fellow

Himani Sharma - Post Doctoral Fellow

Michael Moesken - Intern (Technical University of Dresden)

Cristina Scelsi - Research Process Engineer

INDUSTRY COLLABORATION

Modes of Participation

MEMBERSHIP PROGRAMS

INDUSTRY-ACADEMIA CONSORTIA DEVELOPMENT

Professor Rao R. Tummala, Director Packaging Reserach Center

Welcome to the
Georgia Tech Microsystems
Packaging Research Center

Prof. Rao R. Tummala, Founding Director

PRC Vision: Second Law of Electronics by System-On-Package (SOP)
Unlike Moore 's Law, the first law of electronics, which integrates at IC level, PRC's vision of SOP, System-On-Package (or module) is the Second Law of Electronics for System Integration. SOP is a highly miniaturized system technology combining computing, communication, consumer, and bio-electronic functions in a single package or module. It accomplishes this miniaturization by package integration of system-level components at microscale in the short term and nanoscale in the long term.

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Applications of SOP: Digital convergence, consumer electronics, 3G and beyond communications, health care, safety, and security.

Research Areas of SOP: Mixed signal design, test, materials, processes, assembly, thermal and reliability.

Education in SOP: Undergraduate and graduate courses, curricula, textbooks, research and degrees at BS, MS and Ph.D. levels.

Industry Collaborations in SOP: More than 70 companies collaborate from US, Europe, Japan, Korea, India and Singapore.

Infrastructure in SOP: $50 M state-of-the-art facilities in design, fabrication, assembly, test and reliability.

Faculty and Students: 20 faculty and more than 100 graduates and undergraduate students from ECE, MSE, ME and ChE.

PRC Industry Week - September 15-19, 2008

Read ECE Highlights article

PRC industry members and Georgia Tech PRC faculty leaders, researchers, and students take a minute for a photo at the Embedded Actives & Passives (EMAP) consortium project review meeting.

Dr. Rao Tummala speaks to industry visitors at the Next Generation Flip Chip (NGFC) consortium workshop.

PRC directors and program managers socialize during lunch with NGFC industry visitors.

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