Email this page to a friend:

Melamine-modified urea formaldehyde resin for bonding particleboards
by Hse, Chung-Yun; Fu, Feng; Pan, Hui

Enter e-mail address of recipient:
 
Send an optional message below.
The URL for the page will automatically be added to your message.
 
Enter your e-mail address:

Note: Your e-mail address, and that of your recipient, will be used only in the case of transmission errors and to let the recipient know who sent the page. The information will not be used for any other purpose.