The Department of Defense today issued the final report of the SemiconductorPackaging Assessment Team, "Semiconductor Packaging: A DoD Dual Use TechnologyAssessment."
Semiconductor packaging -- the science and art of establishinginterconnections and a suitable environment for integrated circuit chips --along with high performance electronics, was identified by the Joint Staff andJoint Requirements Oversight Council as a high priority for maintainingsuperiority on the battlefield.
Additionally, DoD, in executing its dual-usetechnology strategy, is increasingly relying on commercial semiconductorpackaging components and technologies to meet Defense needs.
The SemiconductorPackaging Assessment details the analysis and rationale used to identify theDoD actions necessary to ensure that future commercial semiconductor packagingwill be available and affordable for Defense requirements.
The report concludes that commercial capabilities for single-chipsemiconductor packaging are sufficient to meet military needs.
However, theDepartment of Defense currently lacks the early, assured, and affordable accessneeded to meet its requirements for high performance multi-chip modules andother leading-edge semiconductor packaging.
To ensure that militaryrequirements for cost and performance are met, the Semiconductor PackagingAssessment recommends several actions including: continued R&D investment andjoint industry/DoD development of new manufacturing technologies; increaseddevelopment of new materials and computer aided design tools; and continuedefforts to accelerate the use of commercial integrated circuits in militarysystems.
News media desiring a copy of the assessment may obtain one from theDirectoriate of Defense Information, Room 2E765, The Pentagon, or contact Lt.Col. Joan Ferguson, (703) 695-0192.
All others should contactPublic Communications at (703) 697-5737.
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