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Products & Policies | Ex-Im
Bank Policies
Semiconductors/China
December 23, 2004
This notice is to inform the public that the Export-Import Bank of
the United States has received an application to finance the export of
approximately $1.2 billion in U.S. semiconductor manufacturing
equipment to dedicated foundries in China. The U.S. exports will enable
the dedicated 200-mm and 300-mm foundries to produce approximately
80,000 wafers per month (200-mm equivalent) of logic products.
Available information indicates that some of this new production will
be exported from China and consumed globally. Interested parties may
submit comments on this transaction by e-mail to economic.impact@exim.gov
or by mail to 811 Vermont Avenue, NW., Room 1238, Washington, DC 20571,
within 14 days of the date this notice appears in the Federal Register.
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