Project Title:
Laser-Based Detection of Contamination on Adhesive Bonding Surfaces
04.17-0003
911269
Laser-Based Detection of Contamination on Adhesive Bonding Surfaces
Physical Sciences, Inc.
20 New England Business Ctr
Andover
MA
01810
Victor
Dicristina
508-689-0003
LaRC
NAS1-19535
065
04.17-0003
911269
Abstract:
Laser-Based Detection of Contamination on Adhesive Bonding Surfaces
The use of lightweight metallic and composite materials in structures that must function
under extremes of temperature, pressure, and loading presents new challenges to design
engineers. These materials range from common metals to metal-matrix composites as
well as carbon- and silica-based composites. In the joining of these multilayer materials
and the welding of advanced metals, the cleanliness of the interface can play a large
role in the strength of the resulting bond. Through the excitation of fluorescence
in the contaminants by UV light and photoelectric detection methods, a non-destructive
imaging technique for the detection of contaminants that hinder surface bonding will
be developed. Unlike previous applications of this method, a commercially available
UV laser coupled to an image-intensified TV camera to obtain rapid real-time images
of large structures, regardless of shape, will be applied. In addition to inspection,
the system can be employed to remove contaminants via laser ablation and/or vaporization
without damage to the underlying material. Phase I will test the sensitivity of the
detection method for contaminants of interest on aluminum substrates, demonstrate
laser removal of contaminants, and define a prototype system for development in Phase
II.
Applications would be in inspection and preparation of metals prior to welding or
brazing; contamination detection in the manufacture of layered composite structures,
adhesive bonding of composites, and surfaces prepared for film deposition; and detection
of contaminants on optical surfaces, semiconductor wafers, and magnetic storage media.
contamination, bonding, welding, imaging, process control, manufacturing, non-destructive
evaluation