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The Call for Papers for the 2009 International Conference on Nanotechnology for the Forest Products Industry is January 15, 2009

There is still time to submit your abstract for the 2009 International Conference on Nanotechnology for the Forest Products Industry . The deadline for the Call for Papers has been extended to January 15, 2009. Submissions for presentations and posters from industry, academia, government and other organizations are being accepted. This year's event includes expanded sessions on nanocomposites, nano-enabled biomaterials, and new generation bioproducts. Submissions are also welcome on new perspectives on global opportunities, challenges and trends, as well as in areas including law, policy, economics, and environmental health and safety. View the Call for Papers for more details or visit www.tappi.org/09nano.

Registration Now Open for the 2009 TAPPI Flexible Packaging Summit

Registration is now open for the 2009 TAPPI PLACE (Polymers, Laminations, Adhesives, Coatings and Extrusions) Flexible Packaging Summit, April 28-30, 2009 in Columbus, Ohio, USA. The event will include the two-day Consumer Packaging Solutions for Barrier Performance Course and the Symposium on Nanomaterials for Flexible Packaging.

The course will include technical presentations dealing with the technology, materials, coatings and processes that can be used to meet these product expectations; roundtable discussions with industry celebrities as well as interactive study sessions.

The symposium will cover the latest developments in nano barrier enhancement, the impact of anti-microbial nanotechnologies, the impact of active packaging, integrating intelligent packaging nanotechnologies with biodegradable films and food packages, as well as issues, challenges and the future of nanomaterials for flexible packaging.

To learn more about the event, visit www.tappi.org/09placesummit. Make your plans now for Columbus! Register now and save hundreds of dollars!