Publication Date:
March 2006
DCL ID: GEN-06-02
FP-06-01
This Dear Partner
letter has been revised as of March 14, 2006. Please see GEN-06-03.
SUBJECT: Enactment
of the Higher Education Reconciliation Act of 2005 (the HERA),
Pub. L. 109-171
SUMMARY: This letter
contains information on changes made to the loan programs under Title
IV of the Higher Education Act of 1965, as amended (the HEA),
by Pub. L. 109 171
Posted on 03-10-2006
On February 8, 2006, President Bush signed the Higher Education Reconciliation
Act of 2005 (the HERA), Pub. L. 109 171, which made significant
changes to the Higher Education Act of 1965, as amended (the HEA),
and reauthorized the Federal Family Education Loan (FFEL) Program. The
enclosure attached to this Dear Colleague Letter discusses the effect
of the changes made to the HEA by the HERA that affect the William D.
Ford Federal Direct Loan Program, the Federal Perkins Loan Program, and
the Federal Family Education Loan (FFEL) Program. A separate Dear Colleague
Letter will be issued shortly that will discuss the changes made by the
HERA that are not limited to the HEA Title IV loan programs.
Topics in this letter
are grouped alphabetically under two general categories:
· Topics that
primarily affect institutions and borrowers.
· Topics that primarily affect lenders and guaranty agencies.
Unless otherwise
noted, the changes made by the HERA are effective on July 1, 2006. If
you have any questions on the matters discussed in this letter please
contact Pam Moran at (202)-502-7732 or George Harris at (202) 502-7521.
We appreciate your
assistance and cooperation as we work to implement these statutory changes.
Sincerely,
Sally L. Stroup
Assistant Secretary for
Postsecondary Education
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Theresa
S. Shaw
Chief Operating Officer
Federal Student Aid |
Enclosure:
GEN-06-02/FP-06-01:
Enactment of the Higher Education Reconciliation Act of 2005 ("the
HERA"), Pub. L. 109-171 in PDF Format, 1.33MB, 1 page
(Revised
March 14, 2006) - Enactment of the Higher Education Reconciliation
Act of 2005 Loan Issues (Enclosure to GEN-06-02 and FP-06-01) in PDF Format,
67KB, 17 page
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