Award Abstract #0079650
Implementation of Deep Reactive Ion Etching Technology for the Advancement of MEMS and Micro/nanotechnology Research at the University of Louisville

NSF Org:	ECCS Division of Electrical, Communications and Cyber Systems
Initial Amendment Date:	September 8, 2000
Latest Amendment Date:	September 8, 2000
Award Number:	0079650
Award Instrument:	Standard Grant
Program Manager:	Usha Varshney ECCS Division of Electrical, Communications and Cyber Systems ENG Directorate for Engineering
Start Date:	August 1, 2000
Expires:	July 31, 2002 (Estimated)
Awarded Amount to Date:	$333000
Investigator(s):	Kevin Walsh walsh@louisville.edu (Principal Investigator) Richard Baldwin (Co-Principal Investigator) Robert Cohn (Co-Principal Investigator) Robert Keynton (Co-Principal Investigator) John Naber (Co-Principal Investigator)
Sponsor:	University of Louisville Research Foundation Inc 2301 S. Third St. Louisville, KY 40208 502/852-8367
NSF Program(s):	INTEGRATIVE SYSTEMS, MAJOR RESEARCH INSTRUMENTATION
Field Application(s):	0206000 Telecommunications
Program Reference Code(s):	OTHR, 1189, 0000
Program Element Code(s):	1519, 1189

ABSTRACT



This MRI proposal enhances and expands upon the active MEMS and Micro/Nanotechnology research program at the University of Louisville through the acquisition of an Inductively Coupled Plasma (ICP) Deep Reactive Ion Etching (DRIE) System. The proposal builds upon (a) existing competitive research facilities in micro/nanotechnology, (b) an interdisciplinary collection of research-oriented faculty from engineering and science departments across the campus, and (c) a significant commitment by the University. The requested DRIE System will provide the enabling technology needed to realize the promise of MEMS and micro/nantechnology over the next decade and to train the engineers and scientists who will use this technology. The specific research activities addresses in this proposal can be grouped into the following concentration areas and are consistent with the expertise of the PIs: 1) Novel DRIE Processing Methodologies, 2) RF MEMS, 3) DRIE-fabricated Sensors and Detectors, 4) Optical MEMS (MOEMS), 5) Microfluidics and Lab-on-a-Chip Systems, 6) Diamond MEMS, 7) CVD Processing of High Aspect Ratio DRIE-fabricated Micromolds, and 8) Application of ICP RIE to Nanolithography. While the heart of this proposal is the development and application of exciting new research opportunities, an education and outreach program will be developed with both updated and new courses that implement DRIE technology, MEMS, and micro/nanofabrication and an associated new Certificate Program. Involved students and industrial professionals will graduate after immersion in an environment with sound science, state-of-the-art technical expertise, and applications to real world problems.

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