Award Abstract #0320869
RUI: MRI Acquisition of a Scanning Electron Microscope with Energy Dispersive X-Ray and C-Mode Scanning Acoustic Microscope for a Centralized Laboratory for Imaging and Metrology

NSF Org:	ECCS Division of Electrical, Communications and Cyber Systems
Initial Amendment Date:	August 27, 2003
Latest Amendment Date:	August 27, 2003
Award Number:	0320869
Award Instrument:	Standard Grant
Program Manager:	Radhakisan S. Baheti ECCS Division of Electrical, Communications and Cyber Systems ENG Directorate for Engineering
Start Date:	September 1, 2003
Expires:	August 31, 2005 (Estimated)
Awarded Amount to Date:	$406395
Investigator(s):	Sean Rommel slremc@rit.edu (Principal Investigator) S. Manian Ramkumar (Co-Principal Investigator) Alan Raisanen (Co-Principal Investigator)
Sponsor:	Rochester Institute of Tech 1 LOMB MEMORIAL DR ROCHESTER, NY 14623 585/475-7525
NSF Program(s):	MAJOR RESEARCH INSTRUMENTATION
Field Application(s):	0112000 System Theory
Program Reference Code(s):	OTHR, 1189, 0000
Program Element Code(s):	1189

ABSTRACT

This major research instrumentation (MRI) grant is submitted within the framework of

the Research in Undergraduate Institutions (RUI) program. The mission of this RUI

submission is the establishment of a Centralized Laboratory of Imaging and

Metrology (CLIM) at the Rochester Institute of Technology. The instrumentation

requested includes a scanning electron microscope (SEM) with energy dispersive X-ray

(EDX) capability and a C-Mode Scanning Acoustic Microscope that would greatly

enhance RIT's ability to conduct competitive undergraduate research.

Intellectual Merit: CLIM will build upon RIT's existing strengths in Semiconductor and

Microsystems fabrication and packaging to bridge the applied research gap between basic

research and product commercialization. The impact of the proposed research

instrumentation will be in the establishment of a strong research base for investigators

and undergraduates. A major component of the investigators vision involves

establishing the undergraduate research infrastructure required to (i) publish in refereed

journals by undergraduates, (ii) enhance RIT's credibility to funding agencies to secure

funding for undergraduate research, and (iii) provide a superior environment for

undergraduate education.

Various examples of research activity enabled by this equipment listed in the Project

Description section of this proposal include: photonic lightwave integrated circuits

fabrication, wafer bonding, microfluidic package analysis, packaging yield analysis, and

Silicon on Insulator substrate characterization. These diverse efforts share a common

need to characterize (i) material properties, (ii) process development, and (iii) failure

mechanisms. Nondestructive structural, and chemical analysis and nanometer-scale

imaging capability is fundamental to the success of the proposed research initiatives. The

scanning electron microscope, energy dispersive X-ray, and a C-Mode Scanning Acoustic

Microscope enable imaging, chemical analysis, and structural analysis, respectively.

Broader Impact: In the first year of this program alone, it is estimated that through

projects, classroom instruction, and research, 150 students will benefit from this

instrumentation. This equipment will be introduced immediately, as a centerpiece to

several classes, which include the following: EMCR 201 (Introduction to Microelectronic

Engineering), EMCR 221 (Introduction to Microlithography), EMCR 350 (IC

Technology), EMCR 564 (Microlithography Systems), EMCR 643 (Thin Film

Processing), EMCR 650 (IC Processing Laboratory), EMCR 680/690 (Senior Seminar

Research), ITFF 455 (Introduction to Surface Mount Electronics Packaging), ITFF 456

(Advanced Concepts in Electronics Packaging), and ITFF 457 (Electronics Packaging

Laboratory).

The research will be conducted by three faculty from RIT (S. L. Rommel-Microelectronic

Engineering, A.D. Raisanen-Semiconductor Microsystems Fabrication Laboratory, and

S.M. Ramkumar- Manufacturing Mechanical Engineering Technology and Packaging

Science) in the area of materials, process and failure characterization of microsystems

development and packaging. This project will foster collaboration between device and

packaging researchers at RIT to realize next-generation, high-performance microsystems.

Please report errors in award information by writing to: awardsearch@nsf.gov.