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Dry Lithography: Environmentally Responsible Processes for High Resolution Pattern Transfer and Elimination of Image Collapse using Positive Tone Resists
Grant Number R829586
RFA: Technology for a Sustainable Environment (2001)

Other views: Selected publication types Journal articles Publications submitted after final report Redisplay this page with Reference Title, Journal, and Author Columns Display this page in RIS format

  • Journal Article (9)
  • Presentation (3)
  • Proceedings (4)
    • Reference Type Citation Progress Report Year Document Sources
    Journal Article Boggiano MK, DeSimone J. Alicyclic photoresists for CO2-based microlithography at 157 nm. Abstracts of Papers of the American Chemical Society 2002;224(PMSE Pt 2):149 R829586 (Final)
    		 not available
    Journal Article Boggiano MK, DeSimone JM. Alicyclic photoresists for CO2-based microlithography at 157 nm. Polymeric Materials Science and Engineering 2002;87:207-208. R829586 (Final)
    		 not available
    Journal Article Boggiano MK, DeSimone JM. Photoresists for CO2-based next-generation microlithography. Abstracts of Papers of the American Chemical Society 2005;229(PMSE Pt 2):83 R829586 (Final)
    		 not available
    Journal Article Boggiano MK, DeSimone JM. Photoresists for CO2-based next-generation microlithography. Polymeric Materials Science and Engineering 2005;92:140-141. R829586 (Final)
    		 not available
    Journal Article Denison GM, Jones III C, DeYoung J, Gross S, et al. The use of 'dry' CO2-based technologies for the enhanced fabrication of microelectronic devices. Polymeric Materials Science and Engineering 2004;90:152-153. R829586 (Final)
    		 not available
    Journal Article Denison GM, Jones CA, DeYoung J, Gross SM, McClain J, Zannoni LA, Hicks E, Wood CD, Boggiano MK, Visintin PM, Bessel CA, Schauer CK, DeSimone JM. Use of 'dry' CO2-based technologies for the enhanced fabrication of microelectronic devices. Abstracts of Papers of the American Chemical Society 2004;227(PMSE Pt 2):89 R829586 (Final)
    		 not available
    Journal Article Maynor BW, Rolland JP, Exner AE, DeSimone JM. Rational fabrication of polymeric nanostructures using soft lithography. Polymer Preprints 2005;46:82 (abstract). R829586 (Final)
    		 not available
    Journal Article Wood CD, DeSimone JM. New fluoropolymers for next generation photolithographic techniques. Polymeric Materials Science and Engineering 2005;92:133. R829586 (Final)
    		 not available
    Journal Article Zannoni LA, DeSimone JM. Synthesis, characterization, and properties of copolymers prepared in dense carbon dioxide towards the development of a 157 nm Photoresist. Polymeric Materials Science and Engineering 2002;87:197-198. R829586 (2002)
    		 not available
    Presentation Zannoni LA, DeSimone JM. Development of a 157 nm photoresist for CO2 based lithography. Presented at the Fluoropolymer 2002 Workshop, Savannah, GA, October 13-16, 2002. R829586 (2002)
    		 not available
    Presentation Zannoni LA, DeSimone JM. Progress towards the development of a 157 nm photoresist for carbon dioxide based lithography. Presented at the International Society for Optical Engineering Meeting, Santa Clara, CA, February 2003. R829586 (2002)
    		 not available
    Presentation Zannoni LA, DeSimone JM. Synthesis, characterization, and properties of copolymers prepared in dense carbon dioxide towards the development of a 157 nm Photoresist. Presented at the National Meeting of the American Chemical Society, Boston, MA, August 21, 2002. R829586 (2002)
    		 not available
    Proceedings Boggiano MK, DeSimone JM. Alicyclic photoresists for CO2-based microlithography at 157 nm. In: Proceedings of the SPIE, Pt. 1, Advances in Resist Technology and Processing XX Santa Clara, CA, February 24-26, 2003, 5039:650-654. R829586 (Final)
    		 not available
    Proceedings Boggiano MK, DeSimone JM. Synthesis of photoresists for 157 nm microlithography using CO2. In: Proceedings of the SPIE, Pt. 1, Advances in Resist Technology and Processing XXI, Santa Clara, CA, February 23-24, 2004, 5376:549-553. R829586 (Final)
    		 not available
    Proceedings Boggiano MK, Wood CD, DeSimone JM. Carbon dioxide-soluble photoresists for next-generation lithography. In: Proceedings of the SPIE, Advances in Resist Technology and Processing XXII, San Jose, CA, February 27-March 4, 2005 (in press, 2005). R829586 (Final)
    		 not available
    Proceedings Zannoni LA, Simhan J, DeSimone JM. Progress towards the development of a 157 nm photoresist for carbon dioxide based lithography. In: Fedynyshyn TH, ed. Proceedings of the International Society for Optical Enginering. Advances in Resist Technology and Processing XX. R829586 (2002)
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    The perspectives, information and conclusions conveyed in research project abstracts, progress reports, final reports, journal abstracts and journal publications convey the viewpoints of the principal investigator and may not represent the views and policies of ORD and EPA. Conclusions drawn by the principal investigators have not been reviewed by the Agency.

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